name:-0.010930061340332
name:-0.038238048553467
name:-0.009192943572998
Collins; Aaron Patent Filings

Collins; Aaron

Patent Applications and Registrations

Patent applications and USPTO patent grants for Collins; Aaron.The latest application filed is for "endoscopic tri-point biopsy needle".

Company Profile
9.6.8
  • Collins; Aaron - Minneapolis MN
  • Collins; Aaron - Exmouth GB
  • Collins; Aaron - Croagh IE
  • Collins; Aaron - County Limerick IE
  • Collins; Aaron - Southampton GB
  • Collins; Aaron - Co. Limerick IE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Fluidization of agglomerated solder microspheres
Grant 11,247,285 - Collins , et al. February 15, 2
2022-02-15
Watermarking a digital image
Grant 10,902,541 - Lees , et al. January 26, 2
2021-01-26
Endoscopic Tri-point Biopsy Needle
App 20210007723 - Cannon; Aideen ;   et al.
2021-01-14
Endoscopic tri-point biopsy needle
Grant 10,820,893 - Cannon , et al. November 3, 2
2020-11-03
Window Placement In A Visual Display
App 20200174631 - Lees; Andrew M. ;   et al.
2020-06-04
Method Of Forming Electrical Connections With Solder Dispensing And Reflow
App 20200164453 - Collins; Aaron ;   et al.
2020-05-28
Slider with bondable surface opposite suspension trace
Grant 10,643,645 - Davidson , et al.
2020-05-05
Watermarking A Digital Image
App 20200126176 - Lees; Andrew ;   et al.
2020-04-23
Slider With Bondable Surface Opposite Suspension Trace
App 20200098388 - Davidson; Paul ;   et al.
2020-03-26
Slider with trailing edge top bond pad interconnect
Grant 10,600,436 - Davidson , et al.
2020-03-24
Method of forming electrical connections with solder dispensing and reflow
Grant 10,556,284 - Collins , et al. Feb
2020-02-11
Endoscopic Tri-point Biopsy Needle
App 20180228476 - Cannon; Aideen ;   et al.
2018-08-16
Adaptor for Multiple Types of Endoscope
App 20180014717 - Benn; Niall ;   et al.
2018-01-18
Method Of Forming Electrical Connections With Solder Dispensing And Reflow
App 20170056995 - Collins; Aaron ;   et al.
2017-03-02

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