Collins; Aaron Michael
Patent Applications and Registrations
Patent applications and USPTO patent grants for Collins; Aaron Michael.The latest application filed is for "head gimbal assembly solder joints and formation thereof using bond pad solder dams".
- Collins; Aaron Michael - Minneapolis MN
| Patent | Date |
|---|---|
| Mounting supports that create a bond pad gap for a hard disk slider Grant 11,355,144 - Stephan , et al. June 7, 2 | 2022-06-07 |
| Methods of controlling a shape and size of solder joints of magnetic recording heads Grant 10,964,342 - Grimm , et al. March 30, 2 | 2021-03-30 |
| Electrically conductive solder non-wettable bond pads in head gimbal assemblies Grant 10,706,880 - Grimm , et al. | 2020-07-07 |
| Method of forming electrical connections using optical triggering for solder Grant 10,646,943 - Collins , et al. | 2020-05-12 |
| Head Gimbal Assembly Solder Joints And Formation Thereof Using Bond Pad Solder Dams App 20190122694 - Davidson; Paul ; et al. | 2019-04-25 |
| Method Of Forming Electrical Connections Using Optical Triggering For Solder App 20180147646 - Collins; Aaron Michael ; et al. | 2018-05-31 |
| Method of forming electrical connections from solder posts Grant 8,947,830 - Collins , et al. February 3, 2 | 2015-02-03 |
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