Colgan; Evan George

Patent Applications and Registrations

Patent applications and USPTO patent grants for Colgan; Evan George.The latest application filed is for "chip package for two-phase cooling and assembly process thereof".

Company Profile

2.50.39

Colgan; Evan George - Montvale NJ
Colgan; Evan George - Montvalle NJ
Colgan; Evan George - Chestnut Ridge NY US
Colgan; Evan George - Armonk NY
Colgan; Evan George - Yorktown Heights NY US
Colgan; Evan George - Suffern NY
Colgan; Evan George - Chester Ridge NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip package for two-phase cooling and assembly process thereof Grant 10,607,963 - Brunschwiler , et al.	2020-03-31
Underfill dispensing using funnels Grant 10,249,516 - Colgan , et al.	2019-04-02
Chip Package For Two-phase Cooling And Assembly Process Thereof App 20180076113 - Brunschwiler; Thomas J. ; et al.	2018-03-15
Underfill dispensing using funnels Grant 9,852,960 - Colgan , et al. December 26, 2	2017-12-26
Underfill Dispensing Using Funnels App 20170309538 - Colgan; Evan George ; et al.	2017-10-26
Underfill Dispensing Using Funnels App 20170271232 - Colgan; Evan George ; et al.	2017-09-21
Cooling system for electronic components Grant 9,342,121 - Anderl , et al. May 17, 2	2016-05-17
Precast thermal interface adhesive for easy and repeated, separation and remating Grant 9,272,498 - Colgan , et al. March 1, 2	2016-03-01
Cooling system for electronic components Grant 9,213,378 - Anderl , et al. December 15, 2	2015-12-15
Process for enhanced 3D integration and structures generated using the same Grant 9,111,925 - Colgan , et al. August 18, 2	2015-08-18
Semiconductor package structures having liquid cooler integrated with first level chip package modules Grant 8,772,927 - Bezama , et al. July 8, 2	2014-07-08
Process For Enhanced 3D Integration and Structures Generated Using the Same App 20130341791 - Colgan; Evan George ; et al.	2013-12-26
Structure and apparatus for cooling integrated circuits using copper microchannels Grant 8,505,617 - Bezama , et al. August 13, 2	2013-08-13
Cooling System for Electronic Components App 20130176679 - Anderl; William James ; et al.	2013-07-11
Stacked and redundant chip coolers Grant 8,418,751 - Bezama , et al. April 16, 2	2013-04-16
Precast Thermal Interface Adhesive For Easy And Repeated, Separation And Remating App 20120276375 - Colgan; Evan George ; et al.	2012-11-01
Structure and Apparatus for Cooling Integrated Circuits Using Copper Microchannels App 20120175100 - Bezama; Raschid Jose ; et al.	2012-07-12
Structure and apparatus for cooling integrated circuits using cooper microchannels Grant 8,210,243 - Bezama , et al. July 3, 2	2012-07-03
Semiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package Modules App 20120049341 - Bezama; Raschid Jose ; et al.	2012-03-01
Semiconductor package structures having liquid coolers integrated with first level chip package modules Grant 8,115,303 - Bezama , et al. February 14, 2	2012-02-14
Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages Grant 8,081,473 - Cipolla , et al. December 20, 2	2011-12-20
Method and apparatus of water cooling several parallel circuit cards each containing several chip packages Grant 8,004,841 - Cipolla , et al. August 23, 2	2011-08-23
Devices and methods for side-coupling optical fibers to optoelectronic components Grant 8,002,477 - Colgan , et al. August 23, 2	2011-08-23
Precast Thermal Interface Adhesive For Easy And Repeated, Separation And Remating App 20110171466 - Colgan; Evan George ; et al.	2011-07-14
Cooling System for Electronic Components App 20100254089 - Anderl; William James ; et al.	2010-10-07
Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements Grant 7,808,781 - Colgan , et al. October 5, 2	2010-10-05
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,803,664 - Colgan , et al. September 28, 2	2010-09-28
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,768,121 - Colgan , et al. August 3, 2	2010-08-03
Apparatus And Method Of Direct Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages App 20100025010 - Cipolla; Thomas M. ; et al.	2010-02-04
Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels App 20100012294 - Bezama; Raschid Jose ; et al.	2010-01-21
Semiconductor Package Structures Having Liquid Coolers Integrated with First Level Chip Package Modules App 20090283902 - Bezama; Raschid Jose ; et al.	2009-11-19
Stacked and Redundant Chip Coolers App 20090283244 - Bezama; Raschid Jose ; et al.	2009-11-19
Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements App 20090284921 - Colgan; Evan George ; et al.	2009-11-19
Method And Apparatus Of Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages App 20090277616 - Cipolla; Thomas M. ; et al.	2009-11-12
Method for Forming a Solder Mold with Venting Channels and Method for Using the Same App 20090039142 - Bezama; Raschid Jose ; et al.	2009-02-12
Solder Mold With Venting Channels App 20090039140 - Bezama; Raschid Jose ; et al.	2009-02-12
Space transforming land grid array interposers Grant 7,473,102 - Colgan , et al. January 6, 2	2009-01-06
Reflective spatial light modulator array including a light blocking layer Grant 7,468,766 - Colgan , et al. December 23, 2	2008-12-23
Devices And Methods For Side-coupling Optical Fibers To Optoelectronic Components App 20080282742 - COLGAN; Evan George ; et al.	2008-11-20
Devices and methods for side-coupling optical fibers to optoelectronic components Grant 7,440,668 - Colgan , et al. October 21, 2	2008-10-21
Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures App 20080242002 - Colgan; Evan George ; et al.	2008-10-02
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,394,659 - Colgan , et al. July 1, 2	2008-07-01
Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures App 20080042264 - Colgan; Evan George ; et al.	2008-02-21
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,288,839 - Colgan , et al. October 30, 2	2007-10-30
Electronic package structures using land grid array interposers for module-to-board interconnection Grant 7,284,992 - Becker , et al. October 23, 2	2007-10-23
Space transforming land grid array interposers App 20070232090 - Colgan; Evan George ; et al.	2007-10-04
Electronic Package Structures Using Land Grid Array Interposers For Module-to-board Interconnection App 20070224845 - Becker; Wiren Dale ; et al.	2007-09-27
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages Grant 7,190,580 - Bezama , et al. March 13, 2	2007-03-13
Devices and methods for side-coupling optical fibers to optoelectronic components App 20070014527 - Colgan; Evan George ; et al.	2007-01-18
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages Grant 7,139,172 - Bezama , et al. November 21, 2	2006-11-21
Devices and methods for side-coupling optical fibers to optoelectronic components Grant 7,116,886 - Colgan , et al. October 3, 2	2006-10-03
Apparatus and methods for cooling semiconductor integrated circuit package structures App 20060109630 - Colgan; Evan George ; et al.	2006-05-25
Fluidic Cooling Systems And Methods For Electronic Components App 20060104031 - Colgan; Evan George ; et al.	2006-05-18
Electroplating apparatus and four mask TFT array process with electroplated metal Grant 7,001,498 - Colgan , et al. February 21, 2	2006-02-21
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages App 20060002088 - Bezama; Raschid Jose ; et al.	2006-01-05
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages App 20060002087 - Bezama; Raschid Jose ; et al.	2006-01-05
Apparatus and methods for cooling semiconductor integrated circuit package structures App 20050189568 - Colgan, Evan George ; et al.	2005-09-01
Devices and methods for side-coupling optical fibers to optoelectronic components App 20050169597 - Colgan, Evan George ; et al.	2005-08-04
Devices and methods for side-coupling optical fibers to optoelectronic components Grant 6,874,950 - Colgan , et al. April 5, 2	2005-04-05
Method of bonding optical fibers and optical fiber assembly Grant 6,817,776 - Colgan , et al. November 16, 2	2004-11-16
LCD cell construction by mechanical thinning of a color filter substrate Grant 6,816,225 - Colgan , et al. November 9, 2	2004-11-09
Direct view display with lenticular lens for improved brightness and wide viewing angle Grant 6,791,639 - Colgan , et al. September 14, 2	2004-09-14
Liquid crystal light valve and method for producing same, and liquid crystal projection display device Grant 6,781,650 - Colgan , et al. August 24, 2	2004-08-24
Chip cooling Grant 6,774,482 - Colgan , et al. August 10, 2	2004-08-10
Chip Cooling App 20040124525 - Colgan, Evan George ; et al.	2004-07-01
Devices and methods for side-coupling optical fibers to optoelectronic components App 20040114859 - Colgan, Evan George ; et al.	2004-06-17
Method of bonding optical fibers and optical fiber assembly App 20040096163 - Colgan, Evan George ; et al.	2004-05-20
Display panel, liquid crystal display panel, and liquid crystal display device App 20030214615 - Colgan, Evan George ; et al.	2003-11-20
Method of forming ohmic contacts using a self doping layer for thin-film transistors Grant 6,620,719 - Andry , et al. September 16, 2	2003-09-16
Touch screen stylus with IR-coupled selection buttons Grant 6,529,189 - Colgan , et al. March 4, 2	2003-03-04
Electroplating apparatus and four mask TFT array process with electroplated metal App 20030038037 - Colgan, Evan George ; et al.	2003-02-27
LCD cell construction by mechanical thinning of a color filter substrate App 20020196405 - Colgan, Evan George ; et al.	2002-12-26
Electroplating apparatus Grant 6,495,005 - Colgan , et al. December 17, 2	2002-12-17
Low resistance wiring in the periphery region of displays App 20020177281 - Amemiya, Takahisa ; et al.	2002-11-28
Partially-overlapped interconnect structure and method of making App 20020111012 - Colgan, Evan George ; et al.	2002-08-15
Method of alignment between sheet materials, method of alignment, substrate assembling method and aligning apparatus App 20020069550 - Noguchi, Michikazu ; et al.	2002-06-13
Method of forming fully self-aligned TFT with improved process window Grant 6,403,407 - Andry , et al. June 11, 2	2002-06-11
Alignment of lenticular sheets Grant 6,346,158 - Colgan , et al. February 12, 2	2002-02-12
Liquid crystal display device Grant 6,259,490 - Colgan , et al. July 10, 2	2001-07-10
Integrated resistor for measuring touch position in a liquid crystal display device Grant 6,204,897 - Colgan , et al. March 20, 2	2001-03-20
Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer Grant 6,177,918 - Colgan , et al. January 23, 2	2001-01-23
Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer Grant 6,057,903 - Colgan , et al. May 2, 2	2000-05-02
Interconnect structure using Al.sub.2 -Cu for an integrated circuit chip Grant 5,925,933 - Colgan , et al. July 20, 1	1999-07-20
Reflective spatial light modulator array Grant 5,706,067 - Colgan , et al. January 6, 1	1998-01-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.