COKI ENGINEERING INC.

Patent Applications and Registrations

Patent applications and USPTO patent grants for COKI ENGINEERING INC..The latest application filed is for "gasket, syringe including same, and method of manufacturing gasket".

Company Profile

3.8.8

COKI ENGINEERING INC. - Osaka JP
Coki Engineering Inc. - Osaka-shi, Osaka JP
COKI ENGINEERING INC - Osaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gasket and syringe having the same Grant 11,446,442 - Yotsutsuji September 20, 2	2022-09-20
Gasket, Syringe Including Same, And Method Of Manufacturing Gasket App 20220243814 - YOTSUTSUJI; Akira	2022-08-04
High-slidability syringe Grant 11,071,830 - Yotsutsuji July 27, 2	2021-07-27
High-slidability Syringe App 20200338272 - YOTSUTSUJI; Akira	2020-10-29
Gasket And Syringe Having The Same App 20200215269 - YOTSUTSUJI; Akira	2020-07-09
Gasket using medical silicone rubber having slidability, and syringe using said gasket Grant 10,456,527 - Yotsutsuji Oc	2019-10-29
Skived film for covering surface of plug for medical purposes, plug for medical purposes using said film, pre-filled syringe using said plug, and method for producing said film Grant 10,004,832 - Yotsutsuji June 26, 2	2018-06-26
Gasket Using Medical Silicone Rubber Having Slidability, And Syringe Using Said Gasket App 20170232202 - YOTSUTSUJI; Akira	2017-08-17
Skived Film For Covering Surface Of Plug For Medical Purposes, Plug For Medical Purposes Using Said Film, Pre-filled Syringe Using Said Plug, And Method For Producing Said Film App 20160129160 - Yotsutsuji; Akira	2016-05-12
Piston Member For Syringe App 20150148751 - Yotsutsuji; Akira	2015-05-28
Skived Film For Covering Surface Of Plug For Medical Purposes, Plug For Medical Purposes Using Said Film, Pre-filled Syringe Using Said Plug And Method For Producing Said Film App 20140207075 - Yotsutsuji; Akira	2014-07-24
Metal Mold, and Formed Body Molding Method by the Metal Mold App 20080271870 - Yotsutsuji; Akira	2008-11-06

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