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Patent applications and USPTO patent grants for Cohn; Michael B..The latest application filed is for "mems device with integral packaging".
Patent | Date |
---|---|
Mems Device With Integral Packaging App 20120193754 - Cohn; Michael B. ;   et al. | 2012-08-02 |
High force MEMS device Grant 7,692,521 - Cohn April 6, 2 | 2010-04-06 |
Mems Device With Integral Packaging App 20080272867 - Cohn; Michael B. ;   et al. | 2008-11-06 |
Microelectromechanical systems using thermocompression bonding Grant 7,276,789 - Cohn , et al. October 2, 2 | 2007-10-02 |
MEMS device with integral packaging App 20050168306 - Cohn, Michael B. ;   et al. | 2005-08-04 |
MEMS device with integral packaging Grant 6,872,902 - Cohn , et al. March 29, 2 | 2005-03-29 |
Microelectromechanical systems using thermocompression bonding Grant 6,853,067 - Cohn , et al. February 8, 2 | 2005-02-08 |
MEMS device with integral packaging App 20040066258 - Cohn, Michael B. ;   et al. | 2004-04-08 |
Compliant hermetic package App 20020179921 - Cohn, Michael B. | 2002-12-05 |
High precision accelerometer App 20020144548 - Cohn, Michael B. ;   et al. | 2002-10-10 |
Micromachined springs for strain relieved electrical connections to IC chips App 20020146919 - Cohn, Michael B. | 2002-10-10 |
MEMS device with integral packaging App 20020096421 - Cohn, Michael B. ;   et al. | 2002-07-25 |
Wafer-to-wafer transfer of microstructures using break-away tethers Grant 6,142,358 - Cohn , et al. November 7, 2 | 2000-11-07 |
Surgical robotic system and hydraulic actuator therefor Grant 5,791,231 - Cohn , et al. A | 1998-08-11 |
Method and apparatus for the assembly of microfabricated devices Grant 5,355,577 - Cohn October 18, 1 | 1994-10-18 |
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