Cohn; Charles

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cohn; Charles.The latest application filed is for "flexible circuit substrate for flip-chip-on-flex applications".

Company Profile

0.14.7

Cohn; Charles - Wayne NJ US
Cohn; Charles - F-83600 les Adrets de l'Esterel FR
Cohn; Charles - Les Adrets de I'Esterel FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material Grant 8,601,683 - Cohn , et al. December 10, 2	2013-12-10
Humeral implant for shoulder prosthesis Grant 7,445,638 - Beguin , et al. November 4, 2	2008-11-04
Flexible circuit substrate for flip-chip-on-flex applications Grant 7,394,028 - Cohn July 1, 2	2008-07-01
Flexible circuit substrate for flip-chip-on-flex applications App 20070194456 - Cohn; Charles	2007-08-23
Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom Grant 7,157,361 - Chowdhury , et al. January 2, 2	2007-01-02
Prosthesis for the glenoid cavity of the scapula App 20060200248 - Beguin; Laurent ; et al.	2006-09-07
Humeral implant for shoulder prosthesis App 20060200249 - Beguin; Laurent ; et al.	2006-09-07
Method For Electrical Interconnection Between Printed Wiring Board Layers Using Through Holes With Solid Core Conductive Material App 20060175081 - Cohn; Charles ; et al.	2006-08-10
Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom App 20060014370 - Chowdhury; Musawir M. ; et al.	2006-01-19
Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material App 20050150682 - Cohn, Charles ; et al.	2005-07-14
Method of manufacturing an integrated circuit package Grant 6,790,760 - Cohn , et al. September 14, 2	2004-09-14
Method of manufacturing a printed wiring board having a discontinuous plating layer Grant 6,740,222 - Cohn May 25, 2	2004-05-25
Integrated circuit package Grant 6,509,642 - Cohn January 21, 2	2003-01-21
Printed wiring board having a discontinuous plating layer and method of manufacture thereof App 20020185311 - Cohn, Charles	2002-12-12
Integrated circuit package having partially exposed conductive layer Grant 6,465,882 - Cohn , et al. October 15, 2	2002-10-15
Ball grid array plastic package Grant 5,926,696 - Baxter , et al. July 20, 1	1999-07-20
Pin-fin heat sink Grant 5,299,090 - Brady , et al. March 29, 1	1994-03-29
Plastic pin grid array package Grant 5,102,829 - Cohn April 7, 1	1992-04-07
Integrated circuit package using plastic encapsulant Grant 4,916,522 - Cohn April 10, 1	1990-04-10

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