| Patent | Date |
|---|
Low-resistivity metallic interconnect structures
Grant 10,224,242 - Yang , et al. | 2019-03-05 |
Enhancing robustness of SOI substrate containing a buried N.sup.+ silicon layer for CMOS processing
Grant 10,204,823 - Bedell , et al. Feb | 2019-02-12 |
Enhancing Robustness Of Soi Substrate Containing A Buried N+ Silicon Layer For Cmos Processing
App 20180122688 - Bedell; Stephen W. ; et al. | 2018-05-03 |
Enhancing robustness of SOI substrate containing a buried N.sup.+ silicon layer for CMOS processing
Grant 9,922,866 - Bedell , et al. March 20, 2 | 2018-03-20 |
Shallow trench isolation for semiconductor devices
Grant 9,698,043 - Chan , et al. July 4, 2 | 2017-07-04 |
Nanoscale interconnect structure
Grant 9,613,900 - Yang , et al. April 4, 2 | 2017-04-04 |
Enhancing Robustness Of Soi Substrate Containing A Buried N+ Silicon Layer For Cmos Processing
App 20170033001 - Bedell; Stephen W. ; et al. | 2017-02-02 |
Nanoscale Interconnect Structure
App 20160148867 - Yang; Chih-Chao ; et al. | 2016-05-26 |
Nanoscale interconnect structure
Grant 9,281,211 - Yang , et al. March 8, 2 | 2016-03-08 |
Nanoscale Interconnect Structure
App 20150228572 - Yang; Chih-Chao ; et al. | 2015-08-13 |
Interconnect structures containing nitrided metallic residues
Grant 9,006,895 - Yang , et al. April 14, 2 | 2015-04-14 |
Interconnect structures containing nitrided metallic residues
Grant 8,962,479 - Yang , et al. February 24, 2 | 2015-02-24 |
Interconnect Structures Containing Nitrided Metallic Residues
App 20140332964 - Yang; Chih-Chao ; et al. | 2014-11-13 |
Interconnect Structures Containing Nitrided Metallic Residues
App 20140332960 - Yang; Chih-Chao ; et al. | 2014-11-13 |
Processing System For Combined Metal Deposition And Reflow Anneal For Forming Interconnect Structures
App 20140216342 - Yang; Chih-Chao ; et al. | 2014-08-07 |
Processing System For Combined Metal Deposition And Reflow Anneal For Forming Interconnect Structures
App 20140220777 - Yang; Chih-Chao ; et al. | 2014-08-07 |
MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION
App 20130333923 - Balseanu; Mihaela ; et al. | 2013-12-19 |
Multilayered low k cap with conformal gap fill and UV stable compressive stress properties
Grant 8,536,069 - Balseanu , et al. September 17, 2 | 2013-09-17 |
Multilayered low k cap with conformal gap fill and UV stable compressive stress properties
Grant 8,492,880 - Balseanu , et al. July 23, 2 | 2013-07-23 |
Multiple Step Anneal Method And Semiconductor Formed By Multiple Step Anneal
App 20130049207 - Liniger; Eric G. ; et al. | 2013-02-28 |
Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same
Grant 8,362,596 - Cohen , et al. January 29, 2 | 2013-01-29 |
MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES
App 20130005146 - Balseanu; Mihaela ; et al. | 2013-01-03 |
Semiconductor Switching Device And Method Of Making The Same
App 20120313194 - Yang; Chih-Chao ; et al. | 2012-12-13 |
MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES
App 20120248617 - Balseanu; Mihaela ; et al. | 2012-10-04 |
Engineered Interconnect Dielectric Caps Having Compressive Stress And Interconnect Structures Containing Same
App 20110012238 - Cohen; Stephan A. ; et al. | 2011-01-20 |
DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS
App 20080230875 - Callegari; Alessandro C. ; et al. | 2008-09-25 |
Diffusion Barrier With Low Dielectric Constant And Semiconductor Device Containing Same
App 20070237970 - Cohen; Stephan A. ; et al. | 2007-10-11 |
Method of forming a ceramic diffusion barrier layer
Grant 7,256,146 - Cohen , et al. August 14, 2 | 2007-08-14 |
Diffusion barrier with low dielectric constant and semiconductor device containing same
Grant 7,252,875 - Cohen , et al. August 7, 2 | 2007-08-07 |
DUV laser annealing and stabilization of SiCOH films
Grant 7,223,670 - Callegari , et al. May 29, 2 | 2007-05-29 |
DUV laser annealing and stabilization of SiCOH films
App 20060040513 - Callegari; Alessandro C. ; et al. | 2006-02-23 |
Interconnect structures incorporating low-k dielectric barrier films
App 20050206004 - Cohen, Stephan A. ; et al. | 2005-09-22 |
Interconnect structures incorporating low-k dielectric barrier films
Grant 6,940,173 - Cohen , et al. September 6, 2 | 2005-09-06 |
Interconnect structures incorporating low-k dielectric barrier films
App 20050087876 - Cohen, Stephan A. ; et al. | 2005-04-28 |
Diffusion barrier with low dielectric constant and semiconductor device containing same
App 20040115407 - Cohen, Stephan A. ; et al. | 2004-06-17 |
Laminated diffusion barrier
Grant 6,726,996 - Barth , et al. April 27, 2 | 2004-04-27 |
Laminated diffusion barrier
App 20020172811 - Barth, Edward Paul ; et al. | 2002-11-21 |
Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits
Grant 5,530,293 - Cohen , et al. June 25, 1 | 1996-06-25 |
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