Coffin; Jeffrey T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Coffin; Jeffrey T..The latest application filed is for "novel reworkable underfills for ceramic mcm c4 protection".

Company Profile

0.8.7

Coffin; Jeffrey T. - Pleasant Valley NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reworkable underfills for ceramic MCM C4 protection Grant 8,492,199 - Coffin , et al. July 23, 2	2013-07-23
Novel Reworkable Underfills For Ceramic Mcm C4 Protection App 20120021567 - Coffin; Jeffrey T. ; et al.	2012-01-26
Method of forming a flip-chip package Grant 8,037,594 - Coffin , et al. October 18, 2	2011-10-18
Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Grant 7,489,512 - Coffin , et al. February 10, 2	2009-02-10
Optimized Thermally Conductive Plate and Attachment Method for Enhanced Thermal Performance and Reliability of Flip Chip Organic Packages App 20080303021 - Coffin; Jeffrey T. ; et al.	2008-12-11
Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Grant 7,319,591 - Coffin , et al. January 15, 2	2008-01-15
Novel Reworkable Underfills For Ceramic Mcm C4 Protection App 20070290378 - Coffin; Jeffrey T. ; et al.	2007-12-20
Optimized Thermally Conductive Plate And Attachment Method For Enhanced Thermal Performance And Reliability Of Flip Chip Organic Packages App 20070236890 - Coffin; Jeffrey T. ; et al.	2007-10-11
Optimized Thermally Conductive Plate And Attachment Method For Enhanced Thermal Performance And Reliability Of Flip Chip Organic Packages App 20060268521 - Coffin; Jeffrey T. ; et al.	2006-11-30
Method for assembling a carrier and a semiconductor device Grant 6,584,684 - Brofman , et al. July 1, 2	2003-07-01
Capping structure for electronics package undergoing compressive socket actuation App 20020079117 - Coffin, Jeffrey T. ; et al.	2002-06-27
Method for assembling a carrier and a semiconductor device App 20010007288 - Brofman, Peter J. ; et al.	2001-07-12
Hermetic CBGA/CCGA structure with thermal paste cooling Grant 5,990,418 - Bivona , et al. November 23, 1	1999-11-23
Multi-layer solder seal band for semiconductor substrates and process Grant 5,881,945 - Edwards , et al. March 16, 1	1999-03-16

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