loadpatents
Patent applications and USPTO patent grants for Coccioli; Roberto.The latest application filed is for "in-packaged multi-channel light engine on single substrate".
Patent | Date |
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Integrated compact in-package light engine Grant 11,381,313 - Liang , et al. July 5, 2 | 2022-07-05 |
In-packaged Multi-channel Light Engine On Single Substrate App 20220123852 - NAGARAJAN; Radhakrishnan L. ;   et al. | 2022-04-21 |
In-packaged multi-channel light engine on single substrate Grant 11,218,242 - Nagarajan , et al. January 4, 2 | 2022-01-04 |
In-packaged Multi-channel Light Engine On Single Substrate App 20210385000 - NAGARAJAN; Radhakrishnan L. ;   et al. | 2021-12-09 |
Method For Co-packaging Light Engine Chiplets On Switch Substrate App 20210384989 - NAGARAJAN; Radhakrashnan L. ;   et al. | 2021-12-09 |
Heatsink For Co-packaged Optical Switch Rack Package App 20210385975 - NAGARAJAN; Radhakrishnan L. ;   et al. | 2021-12-09 |
Co-packaged Light Engine Chiplets On Switch Substrate App 20210385560 - NAGARAJAN; Radhakrishnan L. ;   et al. | 2021-12-09 |
Co-packaged light engine chiplets on switch substrate Grant 11,178,473 - Nagarajan , et al. November 16, 2 | 2021-11-16 |
Method for co-packaging light engine chiplets on switch substrate Grant 11,165,509 - Nagarajan , et al. November 2, 2 | 2021-11-02 |
Heatsink for co-packaged optical switch rack package Grant 11,109,515 - Nagarajan , et al. August 31, 2 | 2021-08-31 |
Integrated Compact In-package Light Engine App 20210175973 - LIANG; Ding ;   et al. | 2021-06-10 |
Compact optical module integrated for communicating cryptocurrency transaction Grant 10,924,269 - Ding , et al. February 16, 2 | 2021-02-16 |
Integrated compact in-package light engine Grant 10,892,830 - Liang , et al. January 12, 2 | 2021-01-12 |
Integrated compact in-package light engine Grant 10,826,613 - Liang , et al. November 3, 2 | 2020-11-03 |
Optical transceiver by FOWLP and DOP multichip integration Grant 10,120,150 - Ding , et al. November 6, 2 | 2018-11-06 |
Optical Transceiver By Fowlp And Dop Multichip Integration App 20180275359 - DING; Liang ;   et al. | 2018-09-27 |
Optical transceiver by FOWLP and DoP multichip integration Grant 10,001,611 - Ding , et al. June 19, 2 | 2018-06-19 |
Compact optical transceiver by hybrid multichip integration Grant 9,921,379 - Ding , et al. March 20, 2 | 2018-03-20 |
Compact Optical Transceiver By Hybrid Multichip Integration App 20170261708 - DING; Liang ;   et al. | 2017-09-14 |
Optical Transceiver By Fowlp And Dop Multichip Integration App 20170254968 - DING; Liang ;   et al. | 2017-09-07 |
Compact optical transceiver by hybrid multichip integration Grant 9,651,751 - Ding , et al. May 16, 2 | 2017-05-16 |
Method and apparatus for improving the performance of edge launch adapters Grant 6,863,548 - Coccioli , et al. March 8, 2 | 2005-03-08 |
Embedded antenna and semiconductor die on a substrate in a laminate package Grant 6,818,985 - Coccioli , et al. November 16, 2 | 2004-11-16 |
Shielded antenna in a semiconductor package Grant 6,770,955 - Coccioli , et al. August 3, 2 | 2004-08-03 |
Method and system for broadband transition from IC package to motherboard Grant 6,700,181 - Coccioli March 2, 2 | 2004-03-02 |
Structure and method for fabrication of a leadless chip carrier with embedded antenna Grant 6,582,979 - Coccioli , et al. June 24, 2 | 2003-06-24 |
High inductance inductor in a semiconductor package Grant 6,512,285 - Hashemi , et al. January 28, 2 | 2003-01-28 |
Structure and method for fabrication of a leadless chip carrier with embedded antenna App 20020167084 - Coccioli, Roberto ;   et al. | 2002-11-14 |
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