Cobbley; Chad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cobbley; Chad.The latest application filed is for "advanced detection of memory device removal, and methods, devices and connectors".

Company Profile

0.10.8

Cobbley; Chad - Boise ID US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Advanced detection of memory device removal, and methods, devices and connectors Grant 8,599,637 - Cooke , et al. December 3, 2	2013-12-03
Advanced Detection Of Memory Device Removal, And Methods, Devices And Connectors App 20120243362 - Cooke; James ; et al.	2012-09-27
Advanced detection of memory device removal, and methods, devices and connectors Grant 8,189,420 - Cooke , et al. May 29, 2	2012-05-29
Advanced Detection Of Memory Device Removal, And Methods, Devices And Connectors App 20100312965 - Cooke; James ; et al.	2010-12-09
Method and stencil for extruding material on a substrate Grant 7,134,390 - Cobbley , et al. November 14, 2	2006-11-14
Method and stencil for extruding material on a substrate App 20050274267 - Cobbley, Chad ; et al.	2005-12-15
Method and stencil for extruding material on a substrate App 20050268801 - Cobbley, Chad ; et al.	2005-12-08
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member Grant 6,853,058 - Cobbley February 8, 2	2005-02-08
Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes Grant 6,689,635 - Cobbley , et al. February 10, 2	2004-02-10
Method and stencil for extruding material on a substrate App 20040011228 - Cobbley, Chad ; et al.	2004-01-22
Substrate for accepting wire bonded or flip-chip components Grant 6,501,157 - Cobbley December 31, 2	2002-12-31
Method and stencil for extruding material on a substrate App 20020139257 - Cobbley, Chad ; et al.	2002-10-03
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member App 20020072150 - Cobbley, Chad	2002-06-13
Method and stencil for extruding material on a substrate App 20020023554 - Cobbley, Chad ; et al.	2002-02-28
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member Grant 6,331,221 - Cobbley December 18, 2	2001-12-18
Method and stencil for extruding material on a substrate Grant 6,089,151 - Cobbley , et al. July 18, 2	2000-07-18
Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes Grant 6,064,120 - Cobbley , et al. May 16, 2	2000-05-16

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