loadpatents
Patent applications and USPTO patent grants for Clemons; Gregory S..The latest application filed is for "an apparatus for semiconductor package inspection".
Patent | Date |
---|---|
Apparatus for semiconductor package inspection Grant 10,794,840 - Zhang , et al. October 6, 2 | 2020-10-06 |
An Apparatus For Semiconductor Package Inspection App 20190339212 - ZHANG; Liang ;   et al. | 2019-11-07 |
Solder in cavity interconnection structures Grant 10,468,367 - Hu , et al. No | 2019-11-05 |
Solder In Cavity Interconnection Structures App 20180151529 - Hu; Chuan ;   et al. | 2018-05-31 |
Solder in cavity interconnection structures Grant 9,530,747 - Hu , et al. December 27, 2 | 2016-12-27 |
Solder In Cavity Interconnection Structures App 20160148892 - Hu; Chuan ;   et al. | 2016-05-26 |
Solder In Cavity Interconnection Structures App 20150187727 - Hu; Chuan ;   et al. | 2015-07-02 |
Solder in cavity interconnection structures Grant 9,006,890 - Hu , et al. April 14, 2 | 2015-04-14 |
Solder in cavity interconnection structures Grant 8,936,967 - Hu , et al. January 20, 2 | 2015-01-20 |
Solder In Cavity Interconnection Structures App 20130128484 - Hu; Chaun ;   et al. | 2013-05-23 |
Solder In Cavity Interconnection Structures App 20120241965 - Hu; Chuan ;   et al. | 2012-09-27 |
Process for precise alignment of packaging caps on a substrate Grant 7,584,536 - Clemons , et al. September 8, 2 | 2009-09-08 |
Process for micro-grooving a polymer alignment layer for a liquid crystal display Grant 7,297,369 - Clemons November 20, 2 | 2007-11-20 |
Apparatus and method for precise alignment of packaging caps on a substrate App 20070257360 - Clemons; Gregory S. ;   et al. | 2007-11-08 |
Apparatus for precise alignment of packaging caps on a substrate Grant 7,275,312 - Clemons , et al. October 2, 2 | 2007-10-02 |
Process for micro-grooving a polymer alignment layer for a liquid crystal display App 20050221009 - Clemons, Gregory S. | 2005-10-06 |
Method and apparatus for bonding a wire to a bond pad on a device Grant 6,892,927 - Rumer , et al. May 17, 2 | 2005-05-17 |
Integrated circuit packaging design and method Grant 6,867,124 - Clemons , et al. March 15, 2 | 2005-03-15 |
Apparatus and method for precise alignment of packaging caps on a substrate App 20040261262 - Clemons, Gregory S. ;   et al. | 2004-12-30 |
Method and apparatus for bonding a wire to a bond pad on a device App 20040211761 - Rumer, Christopher L. ;   et al. | 2004-10-28 |
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