Cleary; Timothy Patrick
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cleary; Timothy Patrick.The latest application filed is for "fabrication of semiconductor interconnect structure".
- Cleary; Timothy Patrick - Portland OR
| Patent | Date |
|---|---|
| Electroless layer plating process and apparatus Grant 7,897,198 - Park , et al. March 1, 2 | 2011-03-01 |
| Fabrication of semiconductor interconnect structure Grant 7,531,463 - Koos , et al. May 12, 2 | 2009-05-12 |
| Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage Grant 7,338,908 - Koos , et al. March 4, 2 | 2008-03-04 |
| Fabrication of semiconductor interconnect structure App 20070105377 - Koos; Daniel A. ; et al. | 2007-05-10 |
| Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements Grant 6,755,954 - Mayer , et al. June 29, 2 | 2004-06-29 |
| Liquid treatment using thin liquid layer App 20040065540 - Mayer, Steven T. ; et al. | 2004-04-08 |
| Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements App 20020195352 - Mayer, Steven T. ; et al. | 2002-12-26 |
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