Clatterbaugh; Jim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Clatterbaugh; Jim.The latest application filed is for "center conductor to integrated circuit for high frequency applications".
- Clatterbaugh; Jim - Santa Rosa CA
| Patent | Date |
|---|---|
| Through-chip via interconnects for stacked integrated circuit structures Grant 7,911,066 - Ehlers , et al. March 22, 2 | 2011-03-22 |
| Center Conductor to Integrated Circuit for High Frequency Applications App 20090079042 - Clatterbaugh; Jim ; et al. | 2009-03-26 |
| Through-Chip Via Interconnects for Stacked Integrated Circuit Structures App 20090057872 - Ehlers; Eric R. ; et al. | 2009-03-05 |
| Electrical interconnection for high-frequency devices Grant 7,408,119 - Qin , et al. August 5, 2 | 2008-08-05 |
| Electrical interconnection for coaxial line to slab line structure including a bead ring Grant 7,295,084 - Tanbakuchi , et al. November 13, 2 | 2007-11-13 |
| High isolation, low loss electronic interconnection App 20070069832 - Tanbakuchi; Hassan ; et al. | 2007-03-29 |
| Electrical interconnection for high-frequency devices App 20050083153 - Qin, Xiaohui ; et al. | 2005-04-21 |
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