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Patent applications and USPTO patent grants for Clarke; Robert J..The latest application filed is for "power semiconductor package with conductive clips".
Patent | Date |
---|---|
Power semiconductor package with conductive clips Grant 9,620,471 - Standing , et al. April 11, 2 | 2017-04-11 |
Power Semiconductor Package with Conductive Clips App 20150262960 - Standing; Martin ;   et al. | 2015-09-17 |
Power semiconductor package Grant 9,048,196 - Standing , et al. June 2, 2 | 2015-06-02 |
Conductive chip-scale package Grant 8,097,938 - Standing , et al. January 17, 2 | 2012-01-17 |
Chip Scale Package App 20090174058 - Standing; Martin ;   et al. | 2009-07-09 |
Chip-scale package Grant 7,524,701 - Standing , et al. April 28, 2 | 2009-04-28 |
Power semiconductor package App 20090008804 - Standing; Martin ;   et al. | 2009-01-08 |
Power semiconductor package Grant 7,466,012 - Standing , et al. December 16, 2 | 2008-12-16 |
Semiconductor package fabrication Grant 7,402,507 - Standing , et al. July 22, 2 | 2008-07-22 |
Chip scale package App 20060240598 - Standing; Martin ;   et al. | 2006-10-26 |
Semiconductor package fabrication App 20060205112 - Standing; Martin ;   et al. | 2006-09-14 |
Power semiconductor package App 20060131760 - Standing; Martin ;   et al. | 2006-06-22 |
Systems and methods for recording and delivering personalized audio messages Grant 5,444,767 - Goetcheus , et al. August 22, 1 | 1995-08-22 |
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