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Claeys; Didier Pierre W Patent Filings

Claeys; Didier Pierre W

Patent Applications and Registrations

Patent applications and USPTO patent grants for Claeys; Didier Pierre W.The latest application filed is for "high density telecommunications system with cable management and heat dissipation features".

Company Profile
1.5.5
  • Claeys; Didier Pierre W - Schaffen BE
  • Claeys; Didier Pierre W. - Shaffen BE
  • CLAEYS; Didier Pierre W. - Schaffen BE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
High density telecommunications system with cable management and heat dissipation features
Grant 10,182,512 - Claeys , et al. Ja
2019-01-15
High density telecommunications chassis with cable management
Grant 9,986,654 - Claeys , et al. May 29, 2
2018-05-29
High density splitter aggregation module
Grant 9,946,045 - Kegerise , et al. April 17, 2
2018-04-17
High Density Telecommunications System With Cable Management And Heat Dissipation Features
App 20170238440 - Claeys; Didier Pierre W ;   et al.
2017-08-17
High density telecommunications systems with cable management and heat dissipation features
Grant 9,521,766 - Claeys , et al. December 13, 2
2016-12-13
High Density Telecommunications Chassis With Cable Management
App 20160212871 - CLAEYS; DIDIER PIERRE W ;   et al.
2016-07-21
High density telecommunications chassis with cable management
Grant 9,285,557 - Claeys , et al. March 15, 2
2016-03-15
High Density Splitter Aggregation Module
App 20160004026 - KEGERISE; Craig Byran ;   et al.
2016-01-07
High Density Telecommunications Systems With Cable Management And Heat Dissipation Features
App 20140002992 - CLAEYS; DIDIER PIERRE W ;   et al.
2014-01-02
High Density Telecommunications Chassis With Cable Management
App 20140003784 - Claeys; Didier Pierre W. ;   et al.
2014-01-02

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