CJ Technology Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for CJ Technology Co., Ltd..The latest application filed is for "adhesive for joining metals and resins, its adhesive layer and application thereof".
- CJ Technology Co., Ltd. - Taipei N/A TW
- CJ Technology Co., Ltd. - New Taipei City TW
- CJ Technology Co., Ltd. - Taipei City TW
| Patent | Date |
|---|---|
| Silicon etchant with high Si/SiO2 etching selectivity and application thereof Grant 11,084,981 - Tsai August 10, 2 | 2021-08-10 |
| Adhesive for joining metals and resins, its adhesive layer and application thereof App 20210108115 - Yu; Tse Wei ; et al. | 2021-04-15 |
| Silicon etchant with high Si/SiO2 etching selectivity and Application thereof App 20200248074 - Kind Code | 2020-08-06 |
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