Circuit Foil Japan Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Circuit Foil Japan Co., Ltd..The latest application filed is for "copper foil for high-density ultra-fine printed wiring board".
- Circuit Foil Japan Co., Ltd. - Tokyo JP
- Circuit Foil Japan Co., Ltd. - Imaichi JP
- CIRCUIT FOIL JAPAN CO., LTD. - 8-9, KANDA-NISHIKICHO 1-CHOME CHIYODA-KU JP
| Patent | Date |
|---|---|
| Copper foil for high-density ultra-fine printed wiring board Grant 7,175,920 - Suzuki , et al. February 13, 2 | 2007-02-13 |
| Copper foil for high-density ultrafine printed wiring boad Grant 7,026,059 - Suzuki , et al. April 11, 2 | 2006-04-11 |
| Copper foil for high-density ultra-fine printed wiring board App 20050249927 - Suzuki, Akitoshi ; et al. | 2005-11-10 |
| Flexible printed wiring board Grant 6,835,442 - Kudo , et al. December 28, 2 | 2004-12-28 |
| Copper foil for high-density ultrafine printed wiring boad App 20040038049 - Suzuki, Akitoshi ; et al. | 2004-02-26 |
| Electrodeposited copper foil for fine pattern and method for producing the same Grant 5,834,140 - Wolski , et al. November 10, 1 | 1998-11-10 |
| Metal foil manufacturing method and an anodized film forming apparatus used therefor Grant 5,441,627 - Kato , et al. August 15, 1 | 1995-08-15 |
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