Ciminelli; Mario J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ciminelli; Mario J..The latest application filed is for "photonic chip features for fiber attachment".
- Ciminelli; Mario J. - Rochester NY
- Ciminelli; Mario J. - Seaford VA
- Ciminelli; Mario J. - Spencerport NY
| Patent | Date |
|---|---|
| Photonic chip features for fiber attachment Grant 11,353,659 - Ciminelli , et al. June 7, 2 | 2022-06-07 |
| Photonic Chip Features for Fiber Attachment App 20200310034 - Ciminelli; Mario J. ; et al. | 2020-10-01 |
| Inkjet printhead with layered ceramic mounting substrate Grant 8,721,042 - Petruchik , et al. May 13, 2 | 2014-05-13 |
| Metalized printhead substrate overmolded with plastic Grant 8,496,317 - Ciminelli , et al. July 30, 2 | 2013-07-30 |
| Method of protecting printhead die face Grant 8,438,730 - Ciminelli May 14, 2 | 2013-05-14 |
| Die mounting assembly formed of dissimilar materials Grant 8,430,474 - Ciminelli , et al. April 30, 2 | 2013-04-30 |
| Method Of Fabricating A Layered Ceramic Substrate App 20130025125 - Petruchik; Dwight J. ; et al. | 2013-01-31 |
| Inkjet Printhead With Layered Ceramic Mounting Substrate App 20130027466 - Petruchik; Dwight J. ; et al. | 2013-01-31 |
| Insert molded printhead substrate Grant 8,246,141 - Petruchik , et al. August 21, 2 | 2012-08-21 |
| Inkjet Printhead With Protective Spacer App 20120188307 - Ciminelli; Mario J. | 2012-07-26 |
| Method Of Protecting Printhead Die Face App 20120186079 - Ciminelli; Mario J. | 2012-07-26 |
| Fluid ejection assembly having a mounting substrate Grant 8,118,406 - Ciminelli , et al. February 21, 2 | 2012-02-21 |
| Die Mounting Assembly Formed Of Dissimilar Materials App 20110304673 - Ciminelli; Mario J. ; et al. | 2011-12-15 |
| Fluid Ejection Assembly Having A Mounting Substrate App 20110080450 - Ciminelli; Mario J. ; et al. | 2011-04-07 |
| Metalized Printhead Substrate Overmolded With Plastic App 20110037808 - Ciminelli; Mario J. ; et al. | 2011-02-17 |
| Fluid-ejecting device with simplified connectivity Grant 7,810,910 - Ciminelli , et al. October 12, 2 | 2010-10-12 |
| Fluid Flow Path In Microfluidic Device App 20080202694 - Serbicki; Jeffrey P. ; et al. | 2008-08-28 |
| Printhead Wirebond Encapsulation App 20080158298 - Serbicki; Jeffrey P. ; et al. | 2008-07-03 |
| Insert Molded Printhead Substrate App 20080149024 - Petruchik; Dwight J. ; et al. | 2008-06-26 |
| Large Area Flat Image Sensor Assembly App 20080012082 - Waldman; Jaime I. ; et al. | 2008-01-17 |
| Fluid-ejecting Device With Simplified Connectivity App 20080001999 - Ciminelli; Mario J. ; et al. | 2008-01-03 |
| Large area flat image sensor assembly Grant 7,276,394 - Waldman , et al. October 2, 2 | 2007-10-02 |
| Large area flat image sensor assembly App 20050019987 - Waldman, Jaime I. ; et al. | 2005-01-27 |
| Strain gauge based sensor with improved linearity Grant 6,568,276 - Ciminelli May 27, 2 | 2003-05-27 |
| Pressure sensor with integral overpressure protection Grant 5,157,973 - Ciminelli October 27, 1 | 1992-10-27 |
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