Chye; Lim Thiam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chye; Lim Thiam.The latest application filed is for "integrated circuit packages, methods of forming integrated circuit packages, and methods of assembling integrated circuit packages".

Company Profile

0.26.25

Chye; Lim Thiam - Singapore SG
Chye; Lim Thiam - Republic of Singapore SG
Chye, Lim Thiam - Repubilc of Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of forming integrated circuit packages Grant 8,709,866 - Fee , et al. April 29, 2	2014-04-29
Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages App 20130330882 - Fee; Setho Sing ; et al.	2013-12-12
Integrated circuit packages Grant 8,531,031 - Fee , et al. September 10, 2	2013-09-10
Integrated Circuit Packages App 20110233745 - Fee; Setho Sing ; et al.	2011-09-29
Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages Grant 7,977,157 - Fee , et al. July 12, 2	2011-07-12
Methods of Forming Integrated Circuit Packages, and Methods of Assembling Integrated Circuit Packages App 20100151630 - Fee; Setho Sing ; et al.	2010-06-17
Methods of assembling integrated circuit packages Grant 7,700,406 - Fee , et al. April 20, 2	2010-04-20
Semiconductor device assemblies and packages including multiple semiconductor device components Grant 7,573,136 - Jiang , et al. August 11, 2	2009-08-11
Methods for assembling semiconductor devices and interposers Grant 7,528,007 - Fee , et al. May 5, 2	2009-05-05
Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages App 20080284000 - Fee; Setho Sing ; et al.	2008-11-20
Invertible microfeature device packages Grant 7,368,810 - Seng , et al. May 6, 2	2008-05-06
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same Grant 7,279,780 - Fee , et al. October 9, 2	2007-10-09
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Grant 7,274,095 - Fee , et al. September 25, 2	2007-09-25
Methods for assembling multiple semiconductor devices Grant 7,198,980 - Jiang , et al. April 3, 2	2007-04-03
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers Grant 7,112,876 - Fee , et al. September 26, 2	2006-09-26
Quad flat no lead (QFN) grid array package Grant 7,109,572 - Fee , et al. September 19, 2	2006-09-19
Methods for assembling semiconductor devices and interposers App 20060194373 - Fee; Setho Sing ; et al.	2006-08-31
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same Grant 7,075,816 - Fee , et al. July 11, 2	2006-07-11
Invertible microfeature device packages and associated methods App 20060035503 - Seng; Eric Tan Swee ; et al.	2006-02-16
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers App 20060006513 - Fee; Setho Sing ; et al.	2006-01-12
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same App 20050285241 - Fee, Setho Sing ; et al.	2005-12-29
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same Grant 6,967,125 - Fee , et al. November 22, 2	2005-11-22
Semiconductor device assemblies and packages including multiple semiconductor device components App 20050218518 - Jiang, Tongbi ; et al.	2005-10-06
Packaged microelectronic component assemblies Grant 6,951,982 - Chye , et al. October 4, 2	2005-10-04
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Grant 6,951,777 - Fee , et al. October 4, 2	2005-10-04
Packaged microelectronic devices and methods of forming same Grant 6,943,450 - Fee , et al. September 13, 2	2005-09-13
Semiconductor device assemblies and packages including multiple semiconductor devices and methods Grant 6,906,415 - Jiang , et al. June 14, 2	2005-06-14
Packaged microelectronic devices and methods of forming same Grant 6,876,066 - Fee , et al. April 5, 2	2005-04-05
Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled Grant 6,870,247 - Fee , et al. March 22, 2	2005-03-22
Method of manufacturing wire bonded microelectronic device assemblies Grant 6,864,166 - Yin , et al. March 8, 2	2005-03-08
Invertible microfeature device packages and associated methods App 20050046000 - Seng, Eric Tan Swee ; et al.	2005-03-03
Packaged microelectronic devices and methods of forming same App 20050023655 - Fee, Setho Sing ; et al.	2005-02-03
Die package Grant 6,825,572 - Tian , et al. November 30, 2	2004-11-30
Ball grid array interposer, packages and methods App 20040217459 - Fee, Setho Sing ; et al.	2004-11-04
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate App 20040203191 - Fee, Setho Sing ; et al.	2004-10-14
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Grant 6,773,960 - Fee , et al. August 10, 2	2004-08-10
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same App 20040114426 - Fee, Setho Sing ; et al.	2004-06-17
Ball grid array interposer, packages and methods Grant 6,746,894 - Fee , et al. June 8, 2	2004-06-08
Methods for assembling multiple semiconductor devices App 20040106229 - Jiang, Tongbi ; et al.	2004-06-03
Packaged microelectronic component assemblies App 20040100772 - Chye, Lim Thiam ; et al.	2004-05-27
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same App 20040080030 - Fee, Setho Sing ; et al.	2004-04-29
Semiconductor device assemblies and packages including multiple semiconductor devices and methods App 20030230801 - Jiang, Tongbi ; et al.	2003-12-18
Method of manufacturing wire bonded microelectronic device assemblies Grant 6,650,013 - Yin , et al. November 18, 2	2003-11-18
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate App 20030176045 - Fee, Setho Sing ; et al.	2003-09-18
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same App 20030164554 - Fee, Setho Sing ; et al.	2003-09-04
Die package App 20030107138 - Tian, Edmund Lua Koon ; et al.	2003-06-12
Wire bonded microelectronic device assemblies and methods of manufacturing same App 20030049882 - Yin, Leng Nam ; et al.	2003-03-13
Packaged Microelectronic Devices And Methods Of Forming Same App 20030042581 - Fee, Setho Sing ; et al.	2003-03-06
Interposer, packages including the interposer, and methods App 20020167092 - Fee, Setho Sing ; et al.	2002-11-14
Ball grid array interposer, packages and methods App 20020142513 - Fee, Setho Sing ; et al.	2002-10-03

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