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Methods of forming integrated circuit packages Grant 8,709,866 - Fee , et al. April 29, 2 | 2014-04-29 |
Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages App 20130330882 - Fee; Setho Sing ;   et al. | 2013-12-12 |
Integrated circuit packages Grant 8,531,031 - Fee , et al. September 10, 2 | 2013-09-10 |
Integrated Circuit Packages App 20110233745 - Fee; Setho Sing ;   et al. | 2011-09-29 |
Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages Grant 7,977,157 - Fee , et al. July 12, 2 | 2011-07-12 |
Methods of Forming Integrated Circuit Packages, and Methods of Assembling Integrated Circuit Packages App 20100151630 - Fee; Setho Sing ;   et al. | 2010-06-17 |
Methods of assembling integrated circuit packages Grant 7,700,406 - Fee , et al. April 20, 2 | 2010-04-20 |
Semiconductor device assemblies and packages including multiple semiconductor device components Grant 7,573,136 - Jiang , et al. August 11, 2 | 2009-08-11 |
Methods for assembling semiconductor devices and interposers Grant 7,528,007 - Fee , et al. May 5, 2 | 2009-05-05 |
Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages App 20080284000 - Fee; Setho Sing ;   et al. | 2008-11-20 |
Invertible microfeature device packages Grant 7,368,810 - Seng , et al. May 6, 2 | 2008-05-06 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same Grant 7,279,780 - Fee , et al. October 9, 2 | 2007-10-09 |
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Grant 7,274,095 - Fee , et al. September 25, 2 | 2007-09-25 |
Methods for assembling multiple semiconductor devices Grant 7,198,980 - Jiang , et al. April 3, 2 | 2007-04-03 |
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers Grant 7,112,876 - Fee , et al. September 26, 2 | 2006-09-26 |
Quad flat no lead (QFN) grid array package Grant 7,109,572 - Fee , et al. September 19, 2 | 2006-09-19 |
Methods for assembling semiconductor devices and interposers App 20060194373 - Fee; Setho Sing ;   et al. | 2006-08-31 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same Grant 7,075,816 - Fee , et al. July 11, 2 | 2006-07-11 |
Invertible microfeature device packages and associated methods App 20060035503 - Seng; Eric Tan Swee ;   et al. | 2006-02-16 |
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers App 20060006513 - Fee; Setho Sing ;   et al. | 2006-01-12 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same App 20050285241 - Fee, Setho Sing ;   et al. | 2005-12-29 |
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same Grant 6,967,125 - Fee , et al. November 22, 2 | 2005-11-22 |
Semiconductor device assemblies and packages including multiple semiconductor device components App 20050218518 - Jiang, Tongbi ;   et al. | 2005-10-06 |
Packaged microelectronic component assemblies Grant 6,951,982 - Chye , et al. October 4, 2 | 2005-10-04 |
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Grant 6,951,777 - Fee , et al. October 4, 2 | 2005-10-04 |
Packaged microelectronic devices and methods of forming same Grant 6,943,450 - Fee , et al. September 13, 2 | 2005-09-13 |
Semiconductor device assemblies and packages including multiple semiconductor devices and methods Grant 6,906,415 - Jiang , et al. June 14, 2 | 2005-06-14 |
Packaged microelectronic devices and methods of forming same Grant 6,876,066 - Fee , et al. April 5, 2 | 2005-04-05 |
Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled Grant 6,870,247 - Fee , et al. March 22, 2 | 2005-03-22 |
Method of manufacturing wire bonded microelectronic device assemblies Grant 6,864,166 - Yin , et al. March 8, 2 | 2005-03-08 |
Invertible microfeature device packages and associated methods App 20050046000 - Seng, Eric Tan Swee ;   et al. | 2005-03-03 |
Packaged microelectronic devices and methods of forming same App 20050023655 - Fee, Setho Sing ;   et al. | 2005-02-03 |
Die package Grant 6,825,572 - Tian , et al. November 30, 2 | 2004-11-30 |
Ball grid array interposer, packages and methods App 20040217459 - Fee, Setho Sing ;   et al. | 2004-11-04 |
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate App 20040203191 - Fee, Setho Sing ;   et al. | 2004-10-14 |
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Grant 6,773,960 - Fee , et al. August 10, 2 | 2004-08-10 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same App 20040114426 - Fee, Setho Sing ;   et al. | 2004-06-17 |
Ball grid array interposer, packages and methods Grant 6,746,894 - Fee , et al. June 8, 2 | 2004-06-08 |
Methods for assembling multiple semiconductor devices App 20040106229 - Jiang, Tongbi ;   et al. | 2004-06-03 |
Packaged microelectronic component assemblies App 20040100772 - Chye, Lim Thiam ;   et al. | 2004-05-27 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same App 20040080030 - Fee, Setho Sing ;   et al. | 2004-04-29 |
Semiconductor device assemblies and packages including multiple semiconductor devices and methods App 20030230801 - Jiang, Tongbi ;   et al. | 2003-12-18 |
Method of manufacturing wire bonded microelectronic device assemblies Grant 6,650,013 - Yin , et al. November 18, 2 | 2003-11-18 |
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate App 20030176045 - Fee, Setho Sing ;   et al. | 2003-09-18 |
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same App 20030164554 - Fee, Setho Sing ;   et al. | 2003-09-04 |
Die package App 20030107138 - Tian, Edmund Lua Koon ;   et al. | 2003-06-12 |
Wire bonded microelectronic device assemblies and methods of manufacturing same App 20030049882 - Yin, Leng Nam ;   et al. | 2003-03-13 |
Packaged Microelectronic Devices And Methods Of Forming Same App 20030042581 - Fee, Setho Sing ;   et al. | 2003-03-06 |
Interposer, packages including the interposer, and methods App 20020167092 - Fee, Setho Sing ;   et al. | 2002-11-14 |
Ball grid array interposer, packages and methods App 20020142513 - Fee, Setho Sing ;   et al. | 2002-10-03 |