Chye; Chew Beng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chye; Chew Beng.The latest application filed is for "integrated circuit devices with stacked package interposers".

Company Profile

0.8.8

Chye; Chew Beng - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit devices with stacked package interposers Grant 8,058,716 - Chye , et al. November 15, 2	2011-11-15
Integrated Circuit Devices with Stacked Package Interposers App 20100065955 - Chye; Chew Beng ; et al.	2010-03-18
Integrated circuit devices with stacked package interposers Grant 7,622,798 - Chye , et al. November 24, 2	2009-11-24
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths Grant 7,425,470 - Peng , et al. September 16, 2	2008-09-16
Integrated circuit devices with stacked package interposers App 20070246840 - Chye; Chew Beng ; et al.	2007-10-25
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths Grant 7,057,281 - Peng , et al. June 6, 2	2006-06-06
Method and apparatus for cutting semiconductor wafers Grant 7,018,270 - Peng , et al. March 28, 2	2006-03-28
Method and apparatus for cutting semiconductor wafers App 20050268763 - Peng, Neo Chee ; et al.	2005-12-08
Method and apparatus for cutting semiconductor wafers Grant 6,939,199 - Peng , et al. September 6, 2	2005-09-06
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths App 20050012185 - Peng, Neo Chee ; et al.	2005-01-20
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths App 20040173899 - Peng, Neo Chee ; et al.	2004-09-09
Wafer dicing device and method Grant 6,737,606 - Peng , et al. May 18, 2	2004-05-18
Method and apparatus for cutting semiconductor wafers App 20030203538 - Peng, Neo Chee ; et al.	2003-10-30
Method for cutting semiconductor wafers Grant 6,576,531 - Peng , et al. June 10, 2	2003-06-10
Method For Cutting Semiconductor Wafers App 20030060022 - Peng, Neo Chee ; et al.	2003-03-27
Wafer dicing device and method App 20030047543 - Peng, Neo Chee ; et al.	2003-03-13

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