Chyc; Lim Thiam
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chyc; Lim Thiam.The latest application filed is for "die package".
- Chyc; Lim Thiam - Singapore SG
| Patent | Date |
|---|---|
| Die package Grant 7,489,028 - Tian , et al. February 10, 2 | 2009-02-10 |
| Die package App 20050253226 - Tian, Edmund Lua Koon ; et al. | 2005-11-17 |
| Die package Grant 6,919,645 - Tian , et al. July 19, 2 | 2005-07-19 |
| Die package App 20040164410 - Koon Tian, Edmund Lua ; et al. | 2004-08-26 |
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