loadpatents
name:-0.0074930191040039
name:-0.0039288997650146
name:-0.001446008682251
CHUNG; Yoon-jae Patent Filings

CHUNG; Yoon-jae

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHUNG; Yoon-jae.The latest application filed is for "semiconductor package and method of fabricating the same".

Company Profile
0.3.5
  • CHUNG; Yoon-jae - Goyang KR
  • CHUNG; Yoon-Jae - Gyeonggi-do KR
  • Chung; Yoon-Jae - Anyang-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package And Method Of Fabricating The Same
App 20130307145 - CHUNG; Yoon-jae ;   et al.
2013-11-21
Connecting Structure And Adhesion Method Of Pcb Using Anisotropic Conductive Film, And Method For Evaluating Connecting Condition Using The Same
App 20110290538 - HAN; Chul-Jong ;   et al.
2011-12-01
Method of adhering a pair of members
Grant 7,993,417 - Han , et al. August 9, 2
2011-08-09
Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same
App 20090000807 - Han; Chul-Jong ;   et al.
2009-01-01
Anisotropic conductive adhesive
Grant 7,452,923 - Jeon , et al. November 18, 2
2008-11-18
Anisotropic conductive adhesive having PTC characteristics
Grant 7,438,834 - Jang , et al. October 21, 2
2008-10-21
Anisotropic conductive adhesive having PTC characteristics
App 20060118767 - Jang; Jong Yoon ;   et al.
2006-06-08
Isotropic conductive adhesive and adhesive film using the same
App 20050288427 - Jeon, Young Mi ;   et al.
2005-12-29

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