Chung; Yeon-keun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Yeon-keun.The latest application filed is for "integrated circuit pad with separate probing and bonding areas".
- Chung; Yeon-keun - Yongin-si KR
- Chung; Yeon Keun - Chungcheongbuk-Do KR
| Patent | Date |
|---|---|
| Apparatus and method for testing a multi-stack integrated circuit package App 20070018300 - Ryu; Jung-su ; et al. | 2007-01-25 |
| Integrated circuit pad with separate probing and bonding areas App 20070018340 - Kim; Young-Dae ; et al. | 2007-01-25 |
| Overload protector with hermetically sealing structure Grant 6,801,116 - Oh , et al. October 5, 2 | 2004-10-05 |
| Overload protector with hermetically sealing structure App 20040041681 - Oh, Yong Kyun ; et al. | 2004-03-04 |
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