Chung; Yan Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Yan Wen.The latest application filed is for "semiconductor device and method of manufacturing the same".

Company Profile

7.10.12

Chung; Yan Wen - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring structure and method for manufacturing the same Grant 11,329,007 - Huang , et al. May 10, 2	2022-05-10
Semiconductor Device And Method Of Manufacturing The Same App 20220005771 - HUANG; Wen Hung ; et al.	2022-01-06
Semiconductor device package and method for manufacturing the same Grant 11,211,325 - Huang , et al. December 28, 2	2021-12-28
Semiconductor device and method of manufacturing the same Grant 11,127,697 - Huang , et al. September 21, 2	2021-09-21
Wiring structure, electronic device and method for manufacturing the same Grant 11,031,326 - Huang , et al. June 8, 2	2021-06-08
Semiconductor Device Package And Method For Manufacturing The Same App 20210159168 - HUANG; Wen Hung ; et al.	2021-05-27
Semiconductor Device And Method Of Manufacturing The Same App 20210013163 - HUANG; Wen Hung ; et al.	2021-01-14
Wiring structure and method for manufacturing the same Grant 10,892,213 - Huang , et al. January 12, 2	2021-01-12
Wiring Structure And Method For Manufacturing The Same App 20200381369 - HUANG; Wen Hung ; et al.	2020-12-03
Wiring structure and method for manufacturing the same Grant 10,790,241 - Huang , et al. September 29, 2	2020-09-29
Wiring Structure And Method For Manufacturing The Same App 20200279815 - HUANG; Wen Hung ; et al.	2020-09-03
Semiconductor Package Structure And Method For Manufacturing The Same App 20200273722 - HUANG; Wen Hung ; et al.	2020-08-27
Wiring Structure And Method For Manufacturing The Same App 20200211945 - HUANG; Wen Hung ; et al.	2020-07-02
Wiring Structure, Electronic Device And Method For Manufacturing The Same App 20200194361 - HUANG; Wen Hung ; et al.	2020-06-18
Semiconductor package structure and method for manufacturing the same Grant 10,651,052 - Huang , et al.	2020-05-12
Wiring structure, electronic device and method for manufacturing the same Grant 10,643,937 - Huang , et al.	2020-05-05
Semiconductor package and semiconductor process Grant 10,522,492 - Huang , et al. Dec	2019-12-31
Wiring Structure, Electronic Device And Method For Manufacturing The Same App 20190348352 - HUANG; Wen Hung ; et al.	2019-11-14
Wiring structure and semiconductor package having the same Grant 10,468,340 - Huang , et al. No	2019-11-05
Semiconductor Package Structure And Method For Manufacturing The Same App 20190221446 - HUANG; Wen Hung ; et al.	2019-07-18
Wiring Structure And Semiconductor Package Having The Same App 20180366402 - HUANG; Wen Hung ; et al.	2018-12-20
Semiconductor Package And Semiconductor Process App 20180350616 - HUANG; Wen Hung ; et al.	2018-12-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.