Chung; Tae-Gyeong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Tae-Gyeong.The latest application filed is for "semiconductor package and method of forming the same".

Company Profile

2.25.30

Chung; Tae-Gyeong - Suwon-si N/A KR
Chung; Tae-gyeong - Gyeonggi-do KR
Chung; Tae-Gyeong - Suwon KR
Chung; Tae-Gyeong - Suwon-City KR
Chung; Tae-Gyeong - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and method of forming the same Grant 9,685,400 - Hwang , et al. June 20, 2	2017-06-20
Semiconductor package and method of forming the same Grant 9,484,292 - Hwang , et al. November 1, 2	2016-11-01
Semiconductor Package And Method Of Forming The Same App 20160148913 - HWANG; Tae-Joo ; et al.	2016-05-26
Semiconductor module Grant 8,928,154 - Kang , et al. January 6, 2	2015-01-06
Wire Bonding Method And Semiconductor Package Manufactured Using The Same App 20140339290 - HAN; Won-Gil ; et al.	2014-11-20
Semiconductor Package And Method Of Forming The Same App 20140235017 - HWANG; Tae-Joo ; et al.	2014-08-21
Apparatus And Method Of Detecting A Defect Of A Semiconductor Device App 20140208850 - Kim; Geun-woo ; et al.	2014-07-31
Semiconductor package and method of forming the same Grant 8,736,035 - Hwang , et al. May 27, 2	2014-05-27
Semiconductor Package And Method Of Forming The Same App 20130200515 - HWANG; Tae-Joo ; et al.	2013-08-08
Methods of manufacturing semiconductor chips Grant 8,431,442 - Park , et al. April 30, 2	2013-04-30
Semiconductor package and method of forming the same Grant 8,421,244 - Hwang , et al. April 16, 2	2013-04-16
Stacked Semiconductor Device App 20120326307 - JEONG; Se-young ; et al.	2012-12-27
Methods Of Manufacturing Semiconductor Chips App 20120115307 - Park; Sang Wook ; et al.	2012-05-10
Semiconductor Module App 20120104631 - Kang; Sun-Won ; et al.	2012-05-03
Semiconductor package and method of forming the same Grant 8,129,221 - Hwang , et al. March 6, 2	2012-03-06
Semiconductor module Grant 8,115,324 - Kang , et al. February 14, 2	2012-02-14
Semiconductor package and method of forming the same App 20110294260 - Hwang; Tae-Joo ; et al.	2011-12-01
Semiconductor package and method of forming the same Grant 8,022,555 - Hwang , et al. September 20, 2	2011-09-20
Method of fabricating electronic device having stacked chips Grant 7,923,291 - Yu , et al. April 12, 2	2011-04-12
Semiconductor Package And Method Of Forming The Same App 20100327439 - Hwang; Tae-Joo ; et al.	2010-12-30
Flip-chip assembly and method of manufacturing the same Grant 7,821,139 - Hwang , et al. October 26, 2	2010-10-26
Method of fabricating electronic device having stacked chips App 20100022051 - Yu; Hae-Jung ; et al.	2010-01-28
Probe Card Having Redistributed Wiring Probe Needle Structure And Probe Card Module Using The Same App 20090278561 - Jo; Cha-jea ; et al.	2009-11-12
Semiconductor module App 20090127717 - Kang; Sun-Won ; et al.	2009-05-21
Semiconductor package having step type die and method for manufacturing the same Grant 7,485,955 - Kang , et al. February 3, 2	2009-02-03
Semiconductor package and method of forming the same App 20080277800 - Hwang; Tae-Joo ; et al.	2008-11-13
Semiconductor Chip Package And Method Of Fabricating The Same App 20080268579 - YU; Hae-Jung ; et al.	2008-10-30
Stack Package And Method Of Manufacturing The Same App 20080173999 - CHUNG; Hyun-Soo ; et al.	2008-07-24
Flip-chip Assembly And Method Of Manufacturing The Same App 20080122084 - HWANG; Tae-Joo ; et al.	2008-05-29
Multi-chip package and method for manufacturing the same Grant 7,368,811 - Kang , et al. May 6, 2	2008-05-06
Wafer level package, multi-package stack, and method of manufacturing the same Grant 7,335,592 - Kim , et al. February 26, 2	2008-02-26
Multi-chip package and method for manufacturing the same App 20060071317 - Kang; In-Ku ; et al.	2006-04-06
Wafer level package, multi-package stack, and method of manufacturing the same App 20060033212 - Kim; Hyeong-Seob ; et al.	2006-02-16
Wafer level package and multi-package stack Grant 6,982,487 - Kim , et al. January 3, 2	2006-01-03
Semiconductor package having step type die and method for manufacturing the same App 20050205975 - Kang, In-Ku ; et al.	2005-09-22
Memory card having a control chip Grant 6,943,438 - Son , et al. September 13, 2	2005-09-13
Stacked chip package with heat transfer wires Grant 6,857,470 - Park , et al. February 22, 2	2005-02-22
Semiconductor device bonding pad resistant to stress and method of fabricating the same Grant 6,812,578 - Kim , et al. November 2, 2	2004-11-02
Stacked chip package with heat transfer wires App 20040196635 - Park, Hee-Jin ; et al.	2004-10-07
Wafer level package, multi-package stack, and method of manufacturing the same App 20040188837 - Kim, Hyeong-Seob ; et al.	2004-09-30
Memory card App 20030197261 - Son, Min-Young ; et al.	2003-10-23
Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereof App 20020119595 - Kim, Shin ; et al.	2002-08-29
Semiconductor device bonding pad resistant to stress and method of fabricating the same App 20020113313 - Kim, Shin ; et al.	2002-08-22
Apparatus and method for containing semiconductor chips to identify known good dies Grant 6,340,838 - Chung , et al. January 22, 2	2002-01-22
Chip-size package (CSP) using a multi-layer laminated lead frame Grant 5,894,107 - Lee , et al. April 13, 1	1999-04-13

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