CHUNG; MYUNG KEE

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHUNG; MYUNG KEE.The latest application filed is for "semiconductor package having pads with stepped structure".

Company Profile

1.9.12

CHUNG; MYUNG KEE - HWASEONG-SI KR
Chung; Myung-Kee - Cheonan-si KR
CHUNG; Myung-kee - Cheon An-si KR
CHUNG; Myung-Kee - Chungcheongnam-do KR
Chung, Myung Kee - Cheonan-city KR
Chung; Myung Kee - Cheonan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Having Pads With Stepped Structure App 20220068886 - CHUNG; MYUNG KEE ; et al.	2022-03-03
Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same Grant 10,872,802 - Chang , et al. December 22, 2	2020-12-22
Method Of Debonding A Carrier Substrate From A Device Substrate, Apparatus For Performing The Same, And Method Of Singulating Se App 20190148207 - CHANG; Gun-Ho ; et al.	2019-05-16
Land grid array package capable of decreasing a height difference between a land and a solder resist Grant 9,041,181 - Lee , et al. May 26, 2	2015-05-26
Method of manufacturing a chip stack package Grant 8,088,648 - Jo , et al. January 3, 2	2012-01-03
Land Grid Array Package Capable Of Decreasing A Height Difference Between A Land And A Solder Resist App 20110198744 - Lee; Hee-chul ; et al.	2011-08-18
Semiconductor Package, Stack Module, Card, And Electronic System App 20100314740 - CHOI; Keun-ho ; et al.	2010-12-16
Chip Stack Package And Method Of Manufacturing The Chip Stack Package App 20100285635 - Jo; Cha-Jea ; et al.	2010-11-11
Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package Grant 7,807,507 - Kim , et al. October 5, 2	2010-10-05
Backgrinding-underfill Film, Method Of Forming The Same, Semiconductor Package Using The Backgrinding-underfill Film, And Method Of Forming The Semiconductor Package App 20100047969 - KIM; WON-KEUN ; et al.	2010-02-25
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same Grant 7,588,964 - Kwon , et al. September 15, 2	2009-09-15
Chip Stack Package And Method Of Manufacturing The Chip Stack Package App 20080230923 - JO; Cha-Jea ; et al.	2008-09-25
Stacked structure of semiconductor devices, semiconductor device package, and methods of fabricating the same App 20080169545 - Kwon; Yong-Chai ; et al.	2008-07-17
Thin Semiconductor Chip Pickup Apparatus And Method App 20080092360 - LEE; Teak-Hoon ; et al.	2008-04-24
Semiconductor package with improved ball land structure Grant 7,064,435 - Chung , et al. June 20, 2	2006-06-20
Semiconductor package with improved ball land structure App 20050023683 - Chung, Myung-Kee ; et al.	2005-02-03
Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof Grant 6,448,661 - Kim , et al. September 10, 2	2002-09-10
Three-dimensional Multi-chip Package Having Chip Selection Pads And Manufacturing Method Thereof App 20020109236 - Kim, Hyeong-Seob ; et al.	2002-08-15
Semiconductor package having an insulating region on an edge of a chip to prevent shorts App 20020056924 - Chung, Myung Kee ; et al.	2002-05-16
Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same Grant 6,041,495 - Yoon , et al. March 28, 2	2000-03-28

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