Chung; Meng-lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Meng-lin.The latest application filed is for "apparatus for three dimensional integrated circuit testing".

Company Profile

0.8.5

Chung; Meng-lin - Taipei TW
Chung; Meng-Lin - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Radio transceiver and RF signal processing device Grant 10,097,231 - Liu , et al. October 9, 2	2018-10-09
Apparatus for three dimensional integrated circuit testing Grant 9,952,279 - Wang , et al. April 24, 2	2018-04-24
Method of shielding through silicon vias in a passive interposer Grant 9,159,564 - Lu , et al. October 13, 2	2015-10-13
Tool and method for modeling interposer RC couplings Grant 8,856,710 - Yeh , et al. October 7, 2	2014-10-07
Apparatus for Three Dimensional Integrated Circuit Testing App 20140176165 - Wang; Mill-Jer ; et al.	2014-06-26
Method Of Shielding Through Silicon Vias In A Passive Interposer App 20140087548 - LU; Hsiang-Tai ; et al.	2014-03-27
Method of shielding through silicon vias in a passive interposer Grant 8,618,640 - Lu , et al. December 31, 2	2013-12-31
Method Of Shielding Through Silicon Vias In A Passive Interposer App 20130026612 - LU; Hsiang-Tai ; et al.	2013-01-31
Tool And Method For Modeling Interposer Rc Couplings App 20130007692 - Yeh; Chao-Yang ; et al.	2013-01-03
Reducing the switching noise on substrate with high grounding resistance Grant 8,269,350 - Chen , et al. September 18, 2	2012-09-18

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