Chung-Long-Shan; Laval

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung-Long-Shan; Laval.The latest application filed is for "apparatus for forming asymmetrical encapsulant beads on wire bonds".

Company Profile

0.16.20

Chung-Long-Shan; Laval - Balmain AU
Chung-Long-Shan; Laval - Mardi AU
Chung Long Shan; Laval - Watanobbi AU

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wire bond encapsulant control method Grant 8,293,589 - Chung-Long-Shan , et al. October 23, 2	2012-10-23
Apparatus For Forming Asymmetrical Encapsulant Beads On Wire Bonds App 20120048185 - Williams; Susan ; et al.	2012-03-01
Electronic Component Assembly Having Profiled Encapsulated Bonds App 20120018905 - Silverbrook; Kia ; et al.	2012-01-26
Electronic component with wire bonds in low modulus fill encapsulant Grant 8,063,318 - Williams , et al. November 22, 2	2011-11-22
Assembly of electronic components Grant 8,039,974 - Silverbrook , et al. October 18, 2	2011-10-18
Method of wire bond encapsulation profiling Grant 8,025,204 - Chung-Long-Shan , et al. September 27, 2	2011-09-27
Method of reducing wire bond profile height in integrated circuits mounted to circuit boards Grant 7,988,033 - Chung-Long-Shan , et al. August 2, 2	2011-08-02
Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards Grant 7,946,465 - Silverbrook , et al. May 24, 2	2011-05-24
Printhead Assembly With Profiled Exterior Surface App 20110025778 - Karppinen; Vesa ; et al.	2011-02-03
Method of adhering wire bond loops to reduce loop height Grant 7,875,504 - Silverbrook , et al. January 25, 2	2011-01-25
Printhead with exterior surface profiled for wiping maintenance station Grant 7,832,838 - Karppinen , et al. November 16, 2	2010-11-16
Integrated circuit support for low profile wire bond Grant 7,824,013 - Chung-Long-Shan , et al. November 2, 2	2010-11-02
Assembly Of Electronic Components App 20100244282 - Silverbrook; Kia ; et al.	2010-09-30
Method of encapsulating wire bonds Grant 7,803,659 - Chung-Long-Shan , et al. September 28, 2	2010-09-28
Method of wire bonding an integrated circuit die and a printed circuit board Grant 7,802,715 - Silverbrook , et al. September 28, 2	2010-09-28
Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards Grant 7,741,720 - Silverbrook , et al. June 22, 2	2010-06-22
Method Of Wire Bonding An Integrated Circuit Die And A Printed Circuit Board App 20100133323 - Silverbrook; Kia ; et al.	2010-06-03
Wire Bond Encapsulant Control Method App 20100124803 - Chung-Long-Shan; Laval ; et al.	2010-05-20
Method Of Encapsulating Wire Bonds App 20100055849 - Chung-Long-Shan; Laval ; et al.	2010-03-04
Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards Grant 7,669,751 - Silverbrook , et al. March 2, 2	2010-03-02
Wire bond encapsulant application control Grant 7,659,141 - Chung-Long-Shan , et al. February 9, 2	2010-02-09
Method of applying encapsulant to wire bonds Grant 7,618,842 - Chung-Long-Shan , et al. November 17, 2	2009-11-17
Printhead With Exterior Surface Profiled For Wiping Maintenance Station App 20090179963 - Karppinen; Vesa ; et al.	2009-07-16
Electronic Component With Wire Bonds In Low Modulus Fill Encapsulant App 20090135569 - Williams; Susan ; et al.	2009-05-28
Electronic Component With Wire Bonds In Low Modulus Fill Encapsulant App 20090079097 - Williams; Susan ; et al.	2009-03-26
Electronic Device With Wire Bonds Adhered Between Integrated Circuits Dies And Printed Circuit Boards App 20090079081 - Silverbrook; Kia ; et al.	2009-03-26
Method Of Forming Low Profile Wire Bonds Between Integrated Circuits Dies And Printed Circuit Boards App 20090078744 - Silverbrook; Kia ; et al.	2009-03-26
Wirebonder Forming Low Profile Wire Bonds Between Integrated Circuits Dies And Printed Circuit Boards App 20090078740 - Silverbrook; Kia ; et al.	2009-03-26
Integrated Circuit Support For Low Profile Wire Bond App 20090079793 - Chung-Long-Shan; Laval ; et al.	2009-03-26
Method Of Reducing Wire Bond Profile Height In Integrated Circuits Mounted To Circuit Boards App 20090081832 - Chung-Long-Shan; Laval ; et al.	2009-03-26
Method Of Applying Encapsulant To Wire Bonds App 20090081834 - Chung-Long-Shan; Laval ; et al.	2009-03-26
Method Of Adhering Wire Bond Loops To Reduce Loop Height App 20090081829 - Silverbrook; Kia ; et al.	2009-03-26
Wire Bond Encapsulant Application Control App 20090081833 - Chung-Long-Shan; Laval ; et al.	2009-03-26
Method Of Wire Bond Encapsulation Profiling App 20090081818 - Chung-Long-Shan; Laval ; et al.	2009-03-26
Multi wire insulation displacement contact and a method of making multi wire terminations App 20060030199 - Chung Long Shan; Laval	2006-02-09
Z-shaped insulation displacement contact Grant 6,702,605 - Chung Long Shan March 9, 2	2004-03-09

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