Chung; Khar Foong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Khar Foong.The latest application filed is for "method of forming a semiconductor package and semiconductor package".
- Chung; Khar Foong - Perak MY
- Chung; Khar Foong - Menglembu MY
| Patent | Date |
|---|---|
| Molding system with movable mold tool Grant 10,639,833 - Chiang , et al. | 2020-05-05 |
| Semiconductor package and method for fabricating a semiconductor package Grant 10,490,470 - Chong , et al. Nov | 2019-11-26 |
| Method of Forming a Semiconductor Package and Semiconductor Package App 20190109103 - Chiang; Chau Fatt ; et al. | 2019-04-11 |
| Semiconductor package and method for fabricating a semiconductor package App 20180174935 - CHONG; Hock Heng ; et al. | 2018-06-21 |
| Molding system with movable mold tool App 20170282426 - CHIANG; Chau Fatt ; et al. | 2017-10-05 |
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