| Patent | Date |
|---|
Apparatus and method of manufacturing tow prepreg
Grant 11,331,691 - Chung , et al. May 17, 2 | 2022-05-17 |
Thermal-activated pressure relief device for fuel cell vehicle
Grant 11,271,225 - Ham , et al. March 8, 2 | 2022-03-08 |
High-pressure composite container having gastight nozzle structure
Grant 11,085,584 - Hwang , et al. August 10, 2 | 2021-08-10 |
Thermal-activated Pressure Relief Device For Fuel Cell Vehicle
App 20200365917 - HAM; Jeong Hyun ; et al. | 2020-11-19 |
Pressure vessel equipped with permeated gas discharging structure
Grant 10,767,814 - Chung , et al. Sep | 2020-09-08 |
Pressure Vessel Equipped With Permeated Gas Discharging Structure
App 20190162365 - CHUNG; Jae Han ; et al. | 2019-05-30 |
Multi-sealed nozzle and pressure vessel including the same
Grant 10,274,132 - Chung , et al. | 2019-04-30 |
Apparatus And Method Of Manufacturing Tow Prepreg
App 20180297055 - CHUNG; Jae Han ; et al. | 2018-10-18 |
High-pressure Tank Having Structure For Radiation Of Heat And Discharge Of Remaining Gas And Method Of Manufacturing The Same
App 20180274725 - CHUNG; Jae Han ; et al. | 2018-09-27 |
Apparatus for fastening gas vessel and manufacturing method of the same
Grant 10,047,910 - Chung August 14, 2 | 2018-08-14 |
Apparatus For Fastening Gas Vessel And Manufacturing Method Of The Same
App 20180003346 - CHUNG; Jae Han | 2018-01-04 |
High-pressure Composite Container Having Gastight Nozzle Structure
App 20180003341 - HWANG; Ki Ho ; et al. | 2018-01-04 |
Multi-sealed Nozzle And Pressure Vessel Including The Same
App 20170175950 - Chung; Jae Han ; et al. | 2017-06-22 |
Fuel gas tank manufacturing method
Grant 9,656,543 - Chung May 23, 2 | 2017-05-23 |
Apparatus for fastening pressure vessel of vehicle and pressure vessel fastening system
Grant 9,656,612 - Chung May 23, 2 | 2017-05-23 |
Apparatus For Fastening Pressure Vessel Of Vehicle And Pressure Vessel Fastening System
App 20160325692 - Chung; Jae Han | 2016-11-10 |
Fuel Gas Tank And Manufacturing Method Thereof
App 20150274006 - Chung; Jae Han | 2015-10-01 |
Integrated circuit packaging system with heatsink cap and method of manufacture thereof
Grant 9,142,481 - Kim , et al. September 22, 2 | 2015-09-22 |
Integrated circuit packaging system with heat spreader and method of manufacture thereof
Grant 9,093,415 - Kim , et al. July 28, 2 | 2015-07-28 |
Integrated Circuit Packaging System With Heat Spreader And Method Of Manufacture Thereof
App 20150084178 - Kim; Oh Han ; et al. | 2015-03-26 |
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
Grant 8,710,634 - Chi , et al. April 29, 2 | 2014-04-29 |
Integrated Circuit Packaging System With Heatsink Cap And Method Of Manufacture Thereof
App 20130322023 - Kim; Gwangjin ; et al. | 2013-12-05 |
Integrated Circuit Packaging System With Leads And Method Of Manufacture Thereof
App 20120223435 - Choi; A Leam ; et al. | 2012-09-06 |
Integrated circuit package system with step mold recess
Grant 8,247,894 - Yoon , et al. August 21, 2 | 2012-08-21 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
Grant 8,093,100 - Choi , et al. January 10, 2 | 2012-01-10 |
Integrated circuit package system with planar interconnects
Grant 8,067,831 - Kwon , et al. November 29, 2 | 2011-11-29 |
Integrated Circuit Packaging System Having Through Silicon Via With Direct Interconnects And Method Of Manufacture Thereof
App 20110062591 - Choi; A Leam ; et al. | 2011-03-17 |
Integrated circuit with step molded inner stacking module package in package system
Grant 7,875,967 - Yang , et al. January 25, 2 | 2011-01-25 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
Grant 7,859,099 - Choi , et al. December 28, 2 | 2010-12-28 |
Integrated Circuit Packaging System With An Integral-interposer-structure And Method Of Manufacture Thereof
App 20100244222 - Chi; HeeJo ; et al. | 2010-09-30 |
Integrated Circuit Packaging System Having Through Silicon Via With Direct Interconnects And Method Of Manufacture Thereof
App 20100148354 - Choi; A Leam ; et al. | 2010-06-17 |
Integrated circuit package-on-package system with central bond wires
Grant 7,687,920 - Yang , et al. March 30, 2 | 2010-03-30 |
Integrated Circuit Package-on-package System With Central Bond Wires
App 20090256267 - Yang; DeokKyung ; et al. | 2009-10-15 |
Integrated Circuit Package System With Step Mold Recess
App 20090236720 - Yoon; In Sang ; et al. | 2009-09-24 |
Integrated Circuit With Step Molded Inner Stacking Module Package In Package System
App 20090224390 - Yang; DeokKyung ; et al. | 2009-09-10 |
Mountable Integrated Circuit Package System With Protrusion
App 20090127715 - Shin; HanGil ; et al. | 2009-05-21 |
Integrated Circuit Package System With Cavity Substrate
App 20080315406 - Chung; Jae Han ; et al. | 2008-12-25 |
Stacked integrated circuits package system with dense routability and high thermal conductivity
Grant 7,445,962 - Choi , et al. November 4, 2 | 2008-11-04 |
Integrated Circuit Package System With Planar Interconnects
App 20070063331 - Kwon; Hyeog Chan ; et al. | 2007-03-22 |
Stacked Integrated Circuits Package System With Dense Routability And High Thermal Conductivity
App 20060197209 - Choi; Bongsuk ; et al. | 2006-09-07 |
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