Chung; Hui Ling
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Hui Ling.The latest application filed is for "stacked expansion card assembly".
- Chung; Hui Ling - New Taipei TW
- Chung; Hui Ling - New Taipei City TW
- Chung; Hui-Ling - Taipei Hsien TW
| Patent | Date |
|---|---|
| Stacked expansion card assembly Grant 9,342,116 - Lai , et al. May 17, 2 | 2016-05-17 |
| Stacked Expansion Card Assembly App 20150169013 - Lai; Chih Ming ; et al. | 2015-06-18 |
| Connector App 20130303026 - Liao; Tse Hsine ; et al. | 2013-11-14 |
| Circuit board and manufacturing method thereof Grant 7,898,820 - Kao , et al. March 1, 2 | 2011-03-01 |
| Circuit board and manufacturing method thereof App 20090034214 - Kao; Yung-Shun ; et al. | 2009-02-05 |
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