Chung; Hsin-Lung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Hsin-Lung.The latest application filed is for "method for fabricating electronic package".

Company Profile

4.22.27

Chung; Hsin-Lung - Taichung TW
Chung; Hsin-Lung - Taichung City TW
Chung; Hsin-Lung - Taichung Hsien TW
- Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating electronic package Grant 10,566,320 - Shih , et al. Feb	2020-02-18
Method For Fabricating Electronic Package App 20190115330 - Shih; Chi-Liang ; et al.	2019-04-18
Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages Grant 10,074,613 - Chiu , et al. September 11, 2	2018-09-11
Electronic Package Structure And Method For Manufacturing The Same App 20180247886 - Chiu; Chih-Hsien ; et al.	2018-08-30
Fabrication method of package having ESD and EMI preventing functions Grant 10,062,582 - Tsai , et al. August 28, 2	2018-08-28
Method of manufacturing semiconductor package Grant 9,997,477 - Tsai , et al. June 12, 2	2018-06-12
Electronic Package Structure And Method For Fabricating The Same App 20180096967 - Tsai; Wen-Jung ; et al.	2018-04-05
Electronic Package Structure And Method For Fabricating The Same App 20180063966 - Chiu; Chih-Hsien ; et al.	2018-03-01
Electronic package structure and method for fabricating the same Grant 9,907,186 - Chiu , et al. February 27, 2	2018-02-27
Method for fabricating package structure Grant 9,899,335 - Chiu , et al. February 20, 2	2018-02-20
Method Of Fabricating Semiconductor Package Having Metal Layer App 20170236787 - Chiu; Chih-Hsien ; et al.	2017-08-17
Semiconductor package having metal layer Grant 9,673,151 - Chiu , et al. June 6, 2	2017-06-06
Method For Fabricating Package Structure App 20170103953 - Chiu; Chih-Hsien ; et al.	2017-04-13
Package structure and fabrication method thereof Grant 9,526,171 - Shih , et al. December 20, 2	2016-12-20
Package structure and method for fabricating the same Grant 9,508,656 - Chiu , et al. November 29, 2	2016-11-29
Electronic package and fabrication method thereof Grant 9,502,758 - Chung , et al. November 22, 2	2016-11-22
Semiconductor package with shielding member and method of manufacturing the same Grant 9,490,219 - Chang , et al. November 8, 2	2016-11-08
Method Of Manufacturing Semiconductor Package App 20160225728 - Tsai; Tsung-Hsien ; et al.	2016-08-04
Semiconductor package and fabrication method thereof Grant 9,343,401 - Shih , et al. May 17, 2	2016-05-17
Semiconductor package and method of manufacturing the same Grant 9,337,250 - Tsai , et al. May 10, 2	2016-05-10
Semiconductor Package And Related Method App 20160093576 - Chiu; Chih-Hsien ; et al.	2016-03-31
Package Structure App 20160081234 - Chiu; Chih-Hsien ; et al.	2016-03-17
Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package Grant 9,257,394 - Chung , et al. February 9, 2	2016-02-09
Package Structure And Method For Fabricating The Same App 20160027740 - Chiu; Chih-Hsien ; et al.	2016-01-28
Package Structure And Fabrication Method Thereof App 20150366085 - Shih; Chi-Liang ; et al.	2015-12-17
Fabrication Method Of Package Having Esd And Emi Preventing Functions App 20150340248 - Tsai; Tsung-Hsien ; et al.	2015-11-26
Semiconductor Package And Method Of Manufacturing The Same App 20150333017 - Chang; Cho-Hsin ; et al.	2015-11-19
Semiconductor Package And Fabrication Method Thereof App 20150243574 - Shih; Chi-Liang ; et al.	2015-08-27
Package having ESD and EMI preventing functions and fabrication method thereof Grant 9,111,945 - Tsai , et al. August 18, 2	2015-08-18
Electronic Package And Fabrication Method Thereof App 20150145747 - Chung; Hsin-Lung ; et al.	2015-05-28
Fabrication method of carrier-free semiconductor package Grant 8,962,396 - Chen , et al. February 24, 2	2015-02-24
Shield, Package Structure And Semiconductor Package Having The Shield And Fabrication Method Of The Semiconductor Package App 20140312473 - Chung; Kuang-Neng ; et al.	2014-10-23
Semiconductor Package, Fabrication Method Thereof And Molding Compound App 20140264958 - Hsu; Tsung-Hsien ; et al.	2014-09-18
Electronic Package, Fabrication Method Thereof And Adhesive Compound App 20140203771 - Hsu; Tsung-Hsien ; et al.	2014-07-24
Semiconductor Package And Method Of Manufacturing The Same App 20140203395 - Tsai; Tsung-Hsien ; et al.	2014-07-24
Semiconductor package and fabrication method thereof Grant 8,766,416 - Hsu , et al. July 1, 2	2014-07-01
Fabrication Method Of Carrier-free Semiconductor Package App 20140080265 - Chen; Ching-Hua ; et al.	2014-03-20
Carrier-free semiconductor package Grant 08618655 -	2013-12-31
Carrier-free semiconductor package Grant 8,618,655 - Chen , et al. December 31, 2	2013-12-31
Semiconductor Package And Fabrication Method Thereof App 20130234337 - Hsu; Tsung-Hsien ; et al.	2013-09-12
Semiconductor Package And Method Of Fabricating The Same App 20120235259 - Fang; Hao-Ju ; et al.	2012-09-20
Carrier-free Semiconductor Package And Fabrication Method Thereof App 20120228769 - Chen; Ching-Hua ; et al.	2012-09-13
Package structure with ESD and EMI preventing functions Grant 8,264,070 - Tsai , et al. September 11, 2	2012-09-11
Semiconductor Package And Fabrication Method Thereof App 20120170162 - Fang; Hao-Ju ; et al.	2012-07-05
Package Having Esd And Emi Preventing Functions And Fabrication Method Thereof App 20120133032 - Tsai; Tsung-Hsien ; et al.	2012-05-31
Package Structure With Esd And Emi Preventing Functions App 20120074538 - Tsai; Tsung-Hsien ; et al.	2012-03-29