Chung; Dennis E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Dennis E..The latest application filed is for "tear away top structure for a rectangular paperboard container".
- Chung; Dennis E. - Toledo OH
- Chung; Dennis E. - Maumee OH
- Chung; Dennis E. - Rossford OH
| Patent | Date |
|---|---|
| Tear away top structure for a rectangular paperboard container Grant 4,911,305 - Chung , et al. March 27, 1 | 1990-03-27 |
| Method and apparatus for packaging a product in individual vacuum sealed packets Grant 4,730,439 - Chung , et al. March 15, 1 | 1988-03-15 |
| Apparatus and method for packaging a product in individual packets Grant 4,631,901 - Chung , et al. December 30, 1 | 1986-12-30 |
| Method and apparatus for making and filling packets with a product Grant 4,545,180 - Chung , et al. October 8, 1 | 1985-10-08 |
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