Chung; Chin-Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Chin-Lung.The latest application filed is for "integrated circuit interconnect structure having discontinuous barrier layer and air gap".
- Chung; Chin-Lung - Hsinchu TW
- Chung, Chin-Lung - Ping-Tung Hsien TW
| Patent | Date |
|---|---|
| Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer And Air Gap App 20220310446 - Chung; Chin-Lung ; et al. | 2022-09-29 |
| Semiconductor Structure And Method For Forming The Same App 20220068799 - LU; MENG-PEI ; et al. | 2022-03-03 |
| Hybrid Via Interconnect Structure App 20210366822 - Chung; Chin-Lung ; et al. | 2021-11-25 |
| Graphene enabled selective barrier layer formation Grant 11,114,374 - Yang , et al. September 7, 2 | 2021-09-07 |
| Graphene Enabled Selective Barrier Layer Formation App 20210057335 - Yang; Shin-Yi ; et al. | 2021-02-25 |
| Apparatus for removing acid substances from hot flue gas App 20040120864 - Chung, Chin-Lung | 2004-06-24 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 