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name:-0.0094051361083984
name:-0.0089161396026611
name:-0.0049288272857666
Chung; Chia-Hung Patent Filings

Chung; Chia-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Chia-Hung.The latest application filed is for "manufacturing method of semiconductor device and semiconductor processing system".

Company Profile
5.12.12
  • Chung; Chia-Hung - Tainan County TW
  • Chung; Chia-Hung - Tainan TW
  • Chung; Chia-Hung - Shanhua Township Tainan County TW
  • Chung; Chia-Hung - Tainan City TW
  • Chung; Chia-Hung - Shanhua Jen TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Manufacturing method of semiconductor device and semiconductor processing system
Grant 11,454,891 - Chen , et al. September 27, 2
2022-09-27
Manufacturing Method Of Semiconductor Device And Semiconductor Processing System
App 20210341843 - Chen; Yu-Kai ;   et al.
2021-11-04
Manufacturing method of semiconductor device and semiconductor processing system
Grant 11,061,333 - Chen , et al. July 13, 2
2021-07-13
Method for monitoring gas in wafer processing system
Grant 11,004,709 - Hsieh , et al. May 11, 2
2021-05-11
Photoresist bottle container
Grant 10,943,802 - Chen , et al. March 9, 2
2021-03-09
Photoresist Bottle Container
App 20200043762 - CHEN; Yu Kai ;   et al.
2020-02-06
Method For Monitoring Gas In Wafer Processing System
App 20190157124 - HSIEH; Wen-Chieh ;   et al.
2019-05-23
Manufacturing Method Of Semiconductor Device And Semiconductor Processing System
App 20190146348 - Chen; Yu-Kai ;   et al.
2019-05-16
Soft material wafer bonding and method of bonding
Grant 8,748,885 - Yeh , et al. June 10, 2
2014-06-10
Wafer and method of processing wafer
Grant 8,592,297 - Yeh , et al. November 26, 2
2013-11-26
Soft Material Wafer Bonding And Method Of Bonding
App 20130207098 - YEH; Tung-Ti ;   et al.
2013-08-15
Wafer And Method Of Processing Wafer
App 20130154060 - YEH; Tung-Ti ;   et al.
2013-06-20
Fault detection and classification (FDC) specification management apparatus and method thereof
Grant 7,254,513 - Lin , et al. August 7, 2
2007-08-07
Fault detection and classification (FDC) specification management apparatus and method thereof
App 20060075314 - Lin; Mu-Tsang ;   et al.
2006-04-06
Chamber wafer detection
Grant 6,938,505 - Chen , et al. September 6, 2
2005-09-06
Wafer cassette pod equipped with position sensing device
Grant 6,775,918 - Tseng , et al. August 17, 2
2004-08-17
Wafer transport pod with linear door opening mechanism
Grant 6,755,602 - Tseng , et al. June 29, 2
2004-06-29
Chamber wafer detection
App 20040031338 - Chen, Kuen-Ei ;   et al.
2004-02-19
Wafer cassette pod equipped with position sensing device
App 20030146129 - Tseng, Hisen-Hwa ;   et al.
2003-08-07
Wafer transport pod with linear door opening mechanism
App 20030147728 - Tseng, Hsien-Hua ;   et al.
2003-08-07

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