Chung; Chee Yee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Chee Yee.The latest application filed is for "power sequencing in an active silicon interposer".

Company Profile

3.20.20

Chung; Chee Yee - Milpitas CA
Chung; Chee-Yee - Chandler AZ
Chung, Chee Yee - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power Sequencing In An Active Silicon Interposer App 20210036702 - Gan; Houle ; et al.	2021-02-04
Electromagnetic interference ("EMI") sheet attenuators Grant 10,905,038 - Centola , et al. January 26, 2	2021-01-26
Power sequencing in an active silicon interposer Grant 10,742,211 - Gan , et al. A	2020-08-11
Multi-phase converter Grant 10,312,813 - Jiang , et al.	2019-06-04
Multi-phase Converter App 20190068061 - Jiang; Shuai ; et al.	2019-02-28
Multi-phase converter Grant 10,141,849 - Jiang , et al. Nov	2018-11-27
Resistive element apparatus and method Grant 7,239,524 - Chung , et al. July 3, 2	2007-07-03
Package Stiffener App 20070120149 - Frutschy; Kristopher ; et al.	2007-05-31
Capacitors having separate terminals on three or more sides Grant 7,176,565 - Li , et al. February 13, 2	2007-02-13
Package stiffener Grant 7,173,329 - Frutschy , et al. February 6, 2	2007-02-06
Capacitor Having Separate Terminals On Three Or More Sides And Methods Of Fabrication App 20060256502 - Li; Yuan-Liang ; et al.	2006-11-16
Integrated circuit packages with sandwiched capacitors Grant 7,133,294 - Patel , et al. November 7, 2	2006-11-07
Dual referenced microstrip Grant 7,109,569 - Breisch , et al. September 19, 2	2006-09-19
Power delivery system having a plurality of stages and method for setting power delivery system parameters Grant 6,946,824 - Waizman , et al. September 20, 2	2005-09-20
Integrated circuit packages with sandwiched capacitors App 20050156280 - Patel, P. R. ; et al.	2005-07-21
Electronic assembly with sandwiched capacitors and methods of manufacture Grant 6,900,991 - Patel , et al. May 31, 2	2005-05-31
Method of fabrication for a socket with embedded conductive structure Grant 6,877,223 - Figueroa , et al. April 12, 2	2005-04-12
Mounting capacitors under ball grid array App 20040125580 - Chung, Chee Yee ; et al.	2004-07-01
Electrical assembly with vertical multiple layer structure Grant 6,717,277 - Chung , et al. April 6, 2	2004-04-06
Dual referenced microstrip App 20040061577 - Breisch, James ; et al.	2004-04-01
Dual referenced microstrip Grant 6,686,819 - Breisch , et al. February 3, 2	2004-02-03
Fabrication method for vertical electronic circuit package and system Grant 6,680,218 - Chung , et al. January 20, 2	2004-01-20
Pad and via placement design for land side capacitors Grant 6,657,275 - Chung , et al. December 2, 2	2003-12-02
Electronic assembly with laterally connected capacitors and manufacturing method Grant 6,636,416 - Li , et al. October 21, 2	2003-10-21
Vertical electronic circuit package and method of fabrication therefor App 20030151146 - Chung, Chee-Yee ; et al.	2003-08-14
Electrical assembly with vertical multiple layer structure App 20030151147 - Chung, Chee-Yee ; et al.	2003-08-14
Dual referenced microstrip App 20030146811 - Breisch, James ; et al.	2003-08-07
Electronic assembly with sandwiched capacitors and methods of manufacture App 20030102555 - Patel, P. R. ; et al.	2003-06-05
Capacitor having separate terminals on three or more sides and methods of fabrication App 20030102523 - Li, Yuan-Liang ; et al.	2003-06-05
Embedded enclosure for effective electromagnetic radiation reduction Grant 6,559,484 - Li , et al. May 6, 2	2003-05-06
Resistive element apparatus and method App 20030072140 - Chung, Chee-Yee ; et al.	2003-04-17
Arrangements to supply power to semiconductor package App 20030062602 - Frutschy, Kristopher ; et al.	2003-04-03
Power delivery system and method for setting power delivery system parameters App 20030046594 - Waizman, Alex ; et al.	2003-03-06
Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction Grant 6,509,640 - Li , et al. January 21, 2	2003-01-21
Vertical electronic circuit package and method of fabrication therefor App 20030003705 - Chung, Chee-Yee ; et al.	2003-01-02
Method of fabrication for a socket with embedded conductive structure App 20020151218 - Figueroa, David G. ; et al.	2002-10-17
System and method for pakage socket with embedded power and ground planes App 20020115330 - Chung, Chee-Yee ; et al.	2002-08-22
System and method for package socket with embedded power and ground planes App 20020115313 - Chung, Chee-Yee ; et al.	2002-08-22
Socket With Embedded Conductive Structure App 20020086568 - Figueroa, David G. ; et al.	2002-07-04
Embedded capacitor assembly in a package Grant 6,346,743 - Figueroa , et al. February 12, 2	2002-02-12

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