Chung; Chang Bum

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Chang Bum.The latest application filed is for "anisotropic conductive film composition".

Company Profile

0.4.6

Chung; Chang Bum - Yongin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Anisotropic conductive film composition Grant 8,419,978 - Kim , et al. April 16, 2	2013-04-16
Anisotropic Conductive Film Composition App 20110133130 - KIM; HYOUN YOUNG ; et al.	2011-06-09
Anisotropic conductive film composition Grant 7,879,259 - Kim , et al. February 1, 2	2011-02-01
Adhesive film composition, associated dicing die bonding film, and die package Grant 7,863,758 - Jung , et al. January 4, 2	2011-01-04
Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same App 20090075008 - Hwang; Yong Ha ; et al.	2009-03-19
Adhesive film composition, associated dicing die bonding film, and die package App 20080145668 - Jung; Ki Sung ; et al.	2008-06-19
Photocurable pressure-sensitive adhesive composition including acrylic binder resin, adhesive tape using the same, and associated methods App 20080108721 - Ha; Kyoung Jin ; et al.	2008-05-08
Anisotropic conductive film composition App 20080099733 - Kim; Hyoun Young ; et al.	2008-05-01
Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package App 20080063871 - Jung; Ki Sung ; et al.	2008-03-13

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