Chung; Bu-Chin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Bu-Chin.The latest application filed is for "gas distributing injector applied in mocvd reactor".

Company Profile

1.8.8

Chung; Bu-Chin - Hsinchu TW
CHUNG; Bu-Chin - Taipei City TW
Chung; Bu-Chin - Taipei TW
Chung; Bu-Chin - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gas Distributing Injector Applied In Mocvd Reactor App 20170314131 - Lin; Po-Jung ; et al.	2017-11-02
Fabrication Method Of Semiconductor Multilayer Structure App 20170117136 - KOBAYASHI; Takashi ; et al.	2017-04-27
System and method for controlling wafer and thin film surface temperature Grant 9,617,636 - Wu , et al. April 11, 2	2017-04-11
Method and system for manufacturing semiconductor epitaxy structure Grant 9,613,875 - Kobayashi , et al. April 4, 2	2017-04-04
Apparatus and method for curvature and thin film stress measurement Grant 9,551,569 - Wu , et al. January 24, 2	2017-01-24
Method And System For Manufacturing Semiconductor Epitaxy Structure App 20160379904 - KOBAYASHI; TAKASHI ; et al.	2016-12-29
Semiconductor Multilayer Structure And Fabrication Method Thereof App 20160293399 - KOBAYASHI; Takashi ; et al.	2016-10-06
Semiconductor Template And Manufacturing Method Thereof App 20160247886 - LIN; Po-Jung ; et al.	2016-08-25
Method and system for manufacturing semiconductor epitaxy structure Grant 9,406,536 - Kobayashi , et al. August 2, 2	2016-08-02
System And Method For Controlling Wafer And Thin Film Surface Temperature App 20160148803 - WU; CHUNG-YUAN ; et al.	2016-05-26
Apparatus And Method For Curvature And Thin Film Stress Measurement App 20160102968 - WU; Chung-Yuan ; et al.	2016-04-14
Vapor Phase Film Deposition Apparatus App 20150096496 - SUDA; Noboru ; et al.	2015-04-09
Method of fabricating flash memory cell Grant 5,837,585 - Wu , et al. November 17, 1	1998-11-17
Etch back method to planarize an interlayer having a critical HDP-CVD deposition process Grant 5,814,564 - Yao , et al. September 29, 1	1998-09-29
Plasma etch equipment Grant 5,587,039 - Salimian , et al. December 24, 1	1996-12-24
Plasma etch process Grant 5,376,223 - Salimian , et al. December 27, 1	1994-12-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.