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name:-0.54327297210693
name:-1.0084130764008
name:-0.085390090942383
Chung; Bradley D. Patent Filings

Chung; Bradley D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chung; Bradley D..The latest application filed is for "printing device temperature management".

Company Profile
3.23.26
  • Chung; Bradley D. - Corvallis OR
  • Chung; Bradley D - Corvallis OR
  • Chung; Bradley D - Coirvallis OR
  • Chung; Bradley D. - Corvalis OR US
  • Chung; Bradley D. - US
  • Chung; Bradley D. - Coravallis OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sample-reagent mixture thermal cycling
Grant 11,110,450 - Chung , et al. September 7, 2
2021-09-07
Printing Device Temperature Management
App 20210129525 - Le; Huy ;   et al.
2021-05-06
Printing device temperature management
Grant 10,994,530 - Le , et al. May 4, 2
2021-05-04
Using Nozzle Idle Time To Determine Maintenance Printing Fluid Ejection
App 20190389206 - Chung; Bradley D ;   et al.
2019-12-26
Addressing pigment settling defects in TIJ by using natural convection to stir the ink
Grant 10,166,770 - Chung , et al. J
2019-01-01
Sample-reagent Mixture Thermal Cycling
App 20180229230 - Chung; Bradley D. ;   et al.
2018-08-16
Addressing Pigment Settling Defects in TIJ by Using Natural Convection to Stir the Ink
App 20180065362 - CHUNG; Bradley D. ;   et al.
2018-03-08
Fluid ejection structure
Grant 9,815,282 - Chung , et al. November 14, 2
2017-11-14
Serpentine direction reversal in bidirectional error diffusion halftoning
Grant 9,782,978 - Chung , et al. October 10, 2
2017-10-10
Serpentine Direction Reversal In Bidirectional Error Diffusion Halftoning
App 20170151808 - Chung; Bradley D ;   et al.
2017-06-01
Fluid Ejection Structure
App 20170106651 - Chung; Bradley D. ;   et al.
2017-04-20
Resistor
Grant 9,511,587 - Cook , et al. December 6, 2
2016-12-06
Heating element for a printhead
Grant 9,289,987 - Cook , et al. March 22, 2
2016-03-22
Heating Element For A Printhead
App 20150266293 - Cook; Galen P. ;   et al.
2015-09-24
Resistor
App 20140224786 - Cook; Galen P. ;   et al.
2014-08-14
Printhead feed slot ribs
Grant 8,733,902 - Chung , et al. May 27, 2
2014-05-27
Multi-member, nested printhead
Grant 8,733,893 - Arthur , et al. May 27, 2
2014-05-27
Thermal resistor fluid ejection assembly
Grant 8,708,461 - Chung , et al. April 29, 2
2014-04-29
Multi-level layer
Grant 8,574,823 - Chung , et al. November 5, 2
2013-11-05
Thermal Resistor Fluid Ejection Assembly
App 20130083131 - Chung; Bradley D. ;   et al.
2013-04-04
Multi-member, Nested Printhead
App 20130027467 - Arthur; Alan R. ;   et al.
2013-01-31
Printing device
Grant 8,333,459 - Rivas , et al. December 18, 2
2012-12-18
Thermal Inkjet Printhead And Method
App 20120139981 - Chaffins; Sterling ;   et al.
2012-06-07
Heating element
Grant 8,141,986 - Chung , et al. March 27, 2
2012-03-27
Dice with polymer ribs
Grant 8,047,156 - Giri , et al. November 1, 2
2011-11-01
Fluid ejection devices and methods of fabrication
Grant 7,909,428 - Donaldson , et al. March 22, 2
2011-03-22
Printhead and method of printing
Grant 7,909,434 - Giere , et al. March 22, 2
2011-03-22
Heating Element
App 20110025785 - Chung; Bradley D. ;   et al.
2011-02-03
Printing Device
App 20110018938 - Rivas; Rio ;   et al.
2011-01-27
Printhead Feed Slot Ribs
App 20110019210 - Chung; Bradley D. ;   et al.
2011-01-27
Heating element
Grant 7,862,156 - Chung , et al. January 4, 2
2011-01-04
Heating element
Grant 7,837,886 - Chung , et al. November 23, 2
2010-11-23
Inkjet-printing Device Printhead Die Having Edge Protection Layer For Heating Resistor
App 20100231655 - Chung; Bradley D. ;   et al.
2010-09-16
Heating Element
App 20090025634 - Chung; Bradley D. ;   et al.
2009-01-29
Heating Element
App 20090027456 - Chung; Bradley D. ;   et al.
2009-01-29
Dice with polymer ribs
App 20090011185 - Giri; Manish ;   et al.
2009-01-08
Printhead and method of printing
App 20080100669 - Ciere; Matthew David ;   et al.
2008-05-01
Multi-level layer
App 20080043166 - Liu; Qin ;   et al.
2008-02-21
Fluid ejection devices and methods of fabrication
App 20080024574 - Donaldson; Jeremy Harlan ;   et al.
2008-01-31
Multi-level layer
App 20070077525 - Davis; Alan T. ;   et al.
2007-04-05
Methods and devices for modulating fluid flow in a micro-fluidic channel
App 20060243934 - Chung; Bradley D. ;   et al.
2006-11-02

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