loadpatents
Patent applications and USPTO patent grants for Chung; Bradley D..The latest application filed is for "printing device temperature management".
Patent | Date |
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Sample-reagent mixture thermal cycling Grant 11,110,450 - Chung , et al. September 7, 2 | 2021-09-07 |
Printing Device Temperature Management App 20210129525 - Le; Huy ;   et al. | 2021-05-06 |
Printing device temperature management Grant 10,994,530 - Le , et al. May 4, 2 | 2021-05-04 |
Using Nozzle Idle Time To Determine Maintenance Printing Fluid Ejection App 20190389206 - Chung; Bradley D ;   et al. | 2019-12-26 |
Addressing pigment settling defects in TIJ by using natural convection to stir the ink Grant 10,166,770 - Chung , et al. J | 2019-01-01 |
Sample-reagent Mixture Thermal Cycling App 20180229230 - Chung; Bradley D. ;   et al. | 2018-08-16 |
Addressing Pigment Settling Defects in TIJ by Using Natural Convection to Stir the Ink App 20180065362 - CHUNG; Bradley D. ;   et al. | 2018-03-08 |
Fluid ejection structure Grant 9,815,282 - Chung , et al. November 14, 2 | 2017-11-14 |
Serpentine direction reversal in bidirectional error diffusion halftoning Grant 9,782,978 - Chung , et al. October 10, 2 | 2017-10-10 |
Serpentine Direction Reversal In Bidirectional Error Diffusion Halftoning App 20170151808 - Chung; Bradley D ;   et al. | 2017-06-01 |
Fluid Ejection Structure App 20170106651 - Chung; Bradley D. ;   et al. | 2017-04-20 |
Resistor Grant 9,511,587 - Cook , et al. December 6, 2 | 2016-12-06 |
Heating element for a printhead Grant 9,289,987 - Cook , et al. March 22, 2 | 2016-03-22 |
Heating Element For A Printhead App 20150266293 - Cook; Galen P. ;   et al. | 2015-09-24 |
Resistor App 20140224786 - Cook; Galen P. ;   et al. | 2014-08-14 |
Printhead feed slot ribs Grant 8,733,902 - Chung , et al. May 27, 2 | 2014-05-27 |
Multi-member, nested printhead Grant 8,733,893 - Arthur , et al. May 27, 2 | 2014-05-27 |
Thermal resistor fluid ejection assembly Grant 8,708,461 - Chung , et al. April 29, 2 | 2014-04-29 |
Multi-level layer Grant 8,574,823 - Chung , et al. November 5, 2 | 2013-11-05 |
Thermal Resistor Fluid Ejection Assembly App 20130083131 - Chung; Bradley D. ;   et al. | 2013-04-04 |
Multi-member, Nested Printhead App 20130027467 - Arthur; Alan R. ;   et al. | 2013-01-31 |
Printing device Grant 8,333,459 - Rivas , et al. December 18, 2 | 2012-12-18 |
Thermal Inkjet Printhead And Method App 20120139981 - Chaffins; Sterling ;   et al. | 2012-06-07 |
Heating element Grant 8,141,986 - Chung , et al. March 27, 2 | 2012-03-27 |
Dice with polymer ribs Grant 8,047,156 - Giri , et al. November 1, 2 | 2011-11-01 |
Fluid ejection devices and methods of fabrication Grant 7,909,428 - Donaldson , et al. March 22, 2 | 2011-03-22 |
Printhead and method of printing Grant 7,909,434 - Giere , et al. March 22, 2 | 2011-03-22 |
Heating Element App 20110025785 - Chung; Bradley D. ;   et al. | 2011-02-03 |
Printing Device App 20110018938 - Rivas; Rio ;   et al. | 2011-01-27 |
Printhead Feed Slot Ribs App 20110019210 - Chung; Bradley D. ;   et al. | 2011-01-27 |
Heating element Grant 7,862,156 - Chung , et al. January 4, 2 | 2011-01-04 |
Heating element Grant 7,837,886 - Chung , et al. November 23, 2 | 2010-11-23 |
Inkjet-printing Device Printhead Die Having Edge Protection Layer For Heating Resistor App 20100231655 - Chung; Bradley D. ;   et al. | 2010-09-16 |
Heating Element App 20090025634 - Chung; Bradley D. ;   et al. | 2009-01-29 |
Heating Element App 20090027456 - Chung; Bradley D. ;   et al. | 2009-01-29 |
Dice with polymer ribs App 20090011185 - Giri; Manish ;   et al. | 2009-01-08 |
Printhead and method of printing App 20080100669 - Ciere; Matthew David ;   et al. | 2008-05-01 |
Multi-level layer App 20080043166 - Liu; Qin ;   et al. | 2008-02-21 |
Fluid ejection devices and methods of fabrication App 20080024574 - Donaldson; Jeremy Harlan ;   et al. | 2008-01-31 |
Multi-level layer App 20070077525 - Davis; Alan T. ;   et al. | 2007-04-05 |
Methods and devices for modulating fluid flow in a micro-fluidic channel App 20060243934 - Chung; Bradley D. ;   et al. | 2006-11-02 |
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