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Patent applications and USPTO patent grants for Chun; Kuk-jin.The latest application filed is for "particulate matter sensor unit".
Patent | Date |
---|---|
Particulate matter sensor unit Grant 9,494,508 - Lee , et al. November 15, 2 | 2016-11-15 |
Semiconductor chip and stacked type semiconductor package having the same Grant 9,390,997 - Kim , et al. July 12, 2 | 2016-07-12 |
Particulate matter sensor unit Grant 9,354,196 - Lim , et al. May 31, 2 | 2016-05-31 |
Particulate Matter Sensor Unit App 20150020576 - Lee; Jin Ha ;   et al. | 2015-01-22 |
Semiconductor Chip And Stacked Type Semiconductor Package Having The Same App 20150008588 - KIM; Jong Hoon ;   et al. | 2015-01-08 |
Particulate Matter Sensor Unit App 20140165699 - LIM; Sera ;   et al. | 2014-06-19 |
Substrate level bonding method and substrate level package Grant 7,998,834 - Kim , et al. August 16, 2 | 2011-08-16 |
Substrate Level Bonding Method And Substrate Level Package App 20100167498 - KIM; Chul-Soo ;   et al. | 2010-07-01 |
Microprobe for testing electronic device and manufacturing method thereof App 20050092709 - Chun, Kuk Jin ;   et al. | 2005-05-05 |
Method for manufacturing ISRC MOSFET Grant 5,747,356 - Lee , et al. May 5, 1 | 1998-05-05 |
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