Chun; Jung Hwan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chun; Jung Hwan.The latest application filed is for "semiconductor devices".
- Chun; Jung Hwan - Anyang-si KR
- CHUN; Jung-hwan - Hwaseong-si KR
- Chun; Jung-hwan - Gyeonggi-do KR
- Chun; Jung Hwan - Chungcheongnam-Do N/A KR
| Patent | Date |
|---|---|
| Semiconductor Devices App 20220310805 - Chun; Jung Hwan ; et al. | 2022-09-29 |
| Integrated Circuit Device App 20210384321 - KWAK; Dae-young ; et al. | 2021-12-09 |
| Integrated circuit device having fin-type active Grant 11,114,544 - Kwak , et al. September 7, 2 | 2021-09-07 |
| Integrated Circuit Device App 20200168720 - Kwak; Dae-young ; et al. | 2020-05-28 |
| Semiconductor package comprising an interposer and method of manufacturing the same Grant 9,024,452 - Chun May 5, 2 | 2015-05-05 |
| Semiconductor package Grant 8,952,514 - Chun February 10, 2 | 2015-02-10 |
| Wafer-level package and method of manufacturing the same Grant 8,912,662 - Chun December 16, 2 | 2014-12-16 |
| Method of manufacturing high-capacity semiconductor package Grant 8,785,254 - Chun July 22, 2 | 2014-07-22 |
| Method Of Manufacturing High-capacity Semiconductor Package App 20130323885 - Chun; Jung Hwan | 2013-12-05 |
| Wafer-level Package And Method Of Manufacturing The Same App 20130320518 - Chun; Jung Hwan | 2013-12-05 |
| Semiconductor Package App 20130082405 - Chun; Jung Hwan | 2013-04-04 |
| Semiconductor Package And Method Of Manufacturing The Same App 20130015571 - CHUN; Jung Hwan | 2013-01-17 |
| Method of dicing wafer using plasma Grant 8,222,120 - Chun , et al. July 17, 2 | 2012-07-17 |
| Wafer through silicon via forming method and equipment therefor Grant 8,202,744 - Chun , et al. June 19, 2 | 2012-06-19 |
| Method Of Dicing Wafer Using Plasma App 20100311223 - Chun; Jung Hwan ; et al. | 2010-12-09 |
| Wafer Through Silicon Via Forming Method And Equipment Therefor App 20100279511 - CHUN; Jung Hwan ; et al. | 2010-11-04 |
| Semiconductor chip package having one or more sealing screws Grant 6,608,380 - Ro , et al. August 19, 2 | 2003-08-19 |
| Semiconductor chip package and manufacturing method thereof App 20020041018 - Ro, Young-Hoon ; et al. | 2002-04-11 |
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