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name:-0.0082359313964844
name:-0.010679006576538
name:-0.00063705444335938
Chun; Do Sung Patent Filings

Chun; Do Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chun; Do Sung.The latest application filed is for "semiconductor package and method for fabricating the same".

Company Profile
0.7.5
  • Chun; Do Sung - Tempe AZ
  • Chun; Do Sung - Chacheongsao TH
  • Chun , Do Sung - Tambon Saladang Amphur Bang-num-Priew TH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package and method for fabricating the same
Grant RE40,112 - Shin , et al. February 26, 2
2008-02-26
Thin semiconductor package including stacked dies
Grant 7,211,900 - Shin , et al. May 1, 2
2007-05-01
Semiconductor package and method for fabricating the same
Grant 7,190,071 - Shin , et al. March 13, 2
2007-03-13
Semiconductor package and method for fabricating the same
Grant 6,982,488 - Shin , et al. January 3, 2
2006-01-03
Semiconductor package and method for fabricating the same
App 20050205979 - Shin, Won Sun ;   et al.
2005-09-22
Semiconductor package and method for fabricating the same
Grant 6,798,049 - Shin , et al. September 28, 2
2004-09-28
Semiconductor package and method for fabricating the same
App 20040164411 - Shin, Won Sun ;   et al.
2004-08-26
Semiconductor package and method for fabricating the same
Grant 6,717,248 - Shin , et al. April 6, 2
2004-04-06
Semiconductor package and method for fabricating the smae
App 20040007771 - Shin, Won Sun ;   et al.
2004-01-15
Semiconductor package and method for fabricating the same
App 20030100142 - Shin, Won Sun ;   et al.
2003-05-29
Semiconductor package and method for fabricating the same
Grant 6,515,356 - Shin , et al. February 4, 2
2003-02-04
Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In The Course Of Making Integrated Circuit Packages
App 20020096253 - Shim , Il Kwon ;   et al.
2002-07-25

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