Chuang; Ya-Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chuang; Ya-Wen.The latest application filed is for "chip packaging device and alignment bonding method thereof".
- Chuang; Ya-Wen - Tainan TW
- Chuang; Ya-Wen - Tainan City TW
- CHUANG; Ya-Wen - Hsinchu TW
- CHUANG; Ya-Wen - Taoyuan City TW
- Chuang, Ya-Wen - Bade City TW
| Patent | Date |
|---|---|
| Chip packaging device and alignment bonding method thereof Grant 10,685,852 - Hsieh , et al. | 2020-06-16 |
| Chip Packaging Device And Alignment Bonding Method Thereof App 20200144078 - Hsieh; Po-Tsung ; et al. | 2020-05-07 |
| Measurement System Of Real-time Spatially-resolved Spectrum And Time-resolved Spectrum And Measurement Module Thereof App 20170016769 - CHOU; Ming-Hsien ; et al. | 2017-01-19 |
| Transparent Electrochromic Polymer And Electrochromic Device App 20150241752 - LIOU; Guey-Sheng ; et al. | 2015-08-27 |
| Protective cover for a vehicle wheel and shaping method therefor App 20050134108 - Chuang, Ya-Wen | 2005-06-23 |
| Vehicle wheel assembly App 20040070259 - Chuang, Ya-Wen | 2004-04-15 |
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