Chuang; Ta-Ko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chuang; Ta-Ko.The latest application filed is for "high rate deposition systems and processes for forming hermetic barrier layers".

Company Profile

0.16.18

Chuang; Ta-Ko - Painted Post NY
Chuang; Ta-Ko - San Jose CA
Chuang; Ta-Ko - Taichung TW
Chuang; Ta-Ko - Taoyuan Shien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High rate deposition systems and processes for forming hermetic barrier layers Grant 10,017,849 - Bellman , et al. July 10, 2	2018-07-10
High Rate Deposition Systems And Processes For Forming Hermetic Barrier Layers App 20170218503 - Bellman; Robert Alan ; et al.	2017-08-03
Method for forming a glass substrate with a depleted surface layer and polycrystalline-silicon TFT built thereon Grant 9,722,084 - Chuang , et al. August 1, 2	2017-08-01
High-speed micro-hole fabrication in glass Grant 9,321,680 - Chuang , et al. April 26, 2	2016-04-26
Glass With Depleted Layer And Polycrystalline-silicon Tft Built Thereon App 20160071981 - Chuang; Ta-Ko ; et al.	2016-03-10
Semiconductor on glass substrate with stiffening layer Grant 8,772,875 - Mohamed , et al. July 8, 2	2014-07-08
High Rate Deposition Systems And Processes For Forming Hermetic Barrier Layers App 20140144772 - Bellman; Robert Alan ; et al.	2014-05-29
High-speed Micro-hole Fabrication In Glass App 20140116091 - Chuang; Ta-Ko ; et al.	2014-05-01
Semiconductor On Glass Substrate With Stiffening Layer And Process Of Making The Same App 20130341756 - Mohamed; Nadia Ben ; et al.	2013-12-26
Oxygen plasma conversion process for preparing a surface for bonding Grant 8,557,679 - Chuang , et al. October 15, 2	2013-10-15
Process of making semiconductor on glass substrates with a stiffening layer Grant 8,518,799 - Mohamed , et al. August 27, 2	2013-08-27
Semiconductor On Glass Substrate With Stiffening Layer And Process Of Making The Same App 20130130473 - Ben Mohamed; Nadia ; et al.	2013-05-23
Semiconductor on glass substrate with stiffening layer and process of making the same Grant 8,357,974 - Mohamed , et al. January 22, 2	2013-01-22
Semiconductor On Glass Substrate With Stiffening Layer And Process Of Making The Same App 20120001293 - Ben Mohamed; Nadia ; et al.	2012-01-05
Oxygen Plasma Conversion Process For Preparing A Surface For Bonding App 20120003813 - Chuang; Ta Ko ; et al.	2012-01-05
Thin film transistor array substrate Grant 7,145,172 - Peng , et al. December 5, 2	2006-12-05
Method of controlling a capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor Grant 7,087,469 - Peng , et al. August 8, 2	2006-08-08
Method of controlling a capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor Grant 6,953,715 - Peng , et al. October 11, 2	2005-10-11
Method of controlling a capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor App 20050037533 - Peng, Chih-Yu ; et al.	2005-02-17
Method of controlling a capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor App 20050032263 - Peng, Chih-Yu ; et al.	2005-02-10
Thin film transistor array substrate App 20050023533 - Peng, Chih-Yu ; et al.	2005-02-03
Method for bonding an integrated circuit device to a glass substrate App 20040221951 - Chuang, Ta-Ko ; et al.	2004-11-11
Method of controlling storage capacitor's capacitance of thin film transistor liquid crystal display Grant 6,800,510 - Peng , et al. October 5, 2	2004-10-05
Method for separating substrates in liquid crystal display Grant 6,741,319 - Chuang , et al. May 25, 2	2004-05-25
Method of controlling storage capacitor's capacitance of thin film transistor liquid crystal display App 20040084678 - Peng, Chih-Yu ; et al.	2004-05-06
Method for separating substrates in liquid crystal display App 20030043332 - Chuang, Ta-Ko ; et al.	2003-03-06
Method for separating a brittle material App 20030019897 - Chuang, Ta-Ko ; et al.	2003-01-30
Method for bonding an integrated circuit device to a glass substrate App 20030019573 - Chuang, Ta-Ko ; et al.	2003-01-30

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