Chuang; Shih-Fang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chuang; Shih-Fang.The latest application filed is for "image processing apparatus and processing method thereof".

Company Profile

0.4.11

Chuang; Shih-Fang - Hsinchu TW
Chuang; Shih-Fang - Hsinchu City TW
Chuang; Shih-Fang - McKinney TX
Chuang; Shih-Fang - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image processing apparatus and processing method thereof Grant 8,810,677 - Hsu , et al. August 19, 2	2014-08-19
Image Processing Apparatus And Processing Method Thereof App 20130128061 - Hsu; Chi-Tung ; et al.	2013-05-23
Method for predicting quantity of taking pictures Grant 7,773,147 - Chuang August 10, 2	2010-08-10
Method for predicting quantity of taking pictures App 20080158390 - Chuang; Shih-Fang	2008-07-03
Thermally Enhanced IC Package and Method App 20080157300 - Chuang; Shih-Fang ; et al.	2008-07-03
Method for dynamically adjusting video frame App 20080151992 - Chuang; Shih-Fang	2008-06-26
Multi-layer structure unit for recording audio/video frame data and its operation method App 20080031593 - Chuang; Shih-Fang ; et al.	2008-02-07
Open architecture picture transfer protocol interface and related method App 20070174035 - Chuang; Shih-Fang	2007-07-26
Board level solder joint support for BGA packages under heatsink compression App 20060043586 - Chiu; Tz-Cheng ; et al.	2006-03-02
Heatsink-substrate-spacer structure for an integrated-circuit package Grant 6,936,919 - Chuang , et al. August 30, 2	2005-08-30
Flip-chip solder bump formation using a wirebonder apparatus App 20050133571 - Chuang, Shih-Fang	2005-06-23
Low coefficient of thermal expansion (CTE) semiconductor packaging materials App 20050110168 - Chuang, Shih-Fang	2005-05-26
Integrated circuit package with heatsink support App 20040036162 - Chuang, Shih-Fang ; et al.	2004-02-26

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