Chuang; Ray

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chuang; Ray.The latest application filed is for "method of reducing oxygen content in ecp solution".

Company Profile

0.6.12

Chuang; Ray - Taipei TW
Chuang; Ray - Hsin Chu TW
Chuang; Ray - Hsinchu TW
Chuang; Ray - Hsin Chu City TW
Chuang; Ray - Hsinchu City TW
Chuang, Ray - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for preventing copper peeling in ECP Grant 7,667,835 - Cheng , et al. February 23, 2	2010-02-23
Post ECP multi-step anneal/H.sub.2 treatment to reduce film impurity Grant 7,432,192 - Feng , et al. October 7, 2	2008-10-07
Method of reducing oxygen content in ECP solution App 20080067076 - Cheng; Ming-Yuan ; et al.	2008-03-20
Apparatus and method for preventing copper peeling in ECP App 20080047827 - Cheng; Hsi-Kuei ; et al.	2008-02-28
Method to reduce Rs pattern dependence effect Grant 7,208,404 - Tsao , et al. April 24, 2	2007-04-24
Method of reducing the pattern effect in the CMP process Grant 7,183,199 - Liu , et al. February 27, 2	2007-02-27
Systems and methods for wafer cleaning App 20070006405 - Feng; Hsien-Ping ; et al.	2007-01-11
Method for fabricating metal layer App 20060219566 - Cheng; Hsi-Kuei ; et al.	2006-10-05
Method for electrochemical plating on semiconductor wafers App 20060213778 - Cheng; Hsi-Kuei ; et al.	2006-09-28
Post ECP multi-step anneal/H2 treatment to reduce film impurity App 20060216930 - Feng; Hsien-Ping ; et al.	2006-09-28
Metallization target optimization method providing enhanced metallization layer uniformity App 20060196765 - Cheng; Hsi-Kuei ; et al.	2006-09-07
Electrostatic chuck assembly having disassembling device Grant 7,102,871 - Chang , et al. September 5, 2	2006-09-05
Post ECP multi-step anneal/H2 treatment to reduce film impurity Grant 7,030,016 - Feng , et al. April 18, 2	2006-04-18
Post ECP multi-step anneal/H2 treatment to reduce film impurity App 20050227479 - Feng, Hsien-Ping ; et al.	2005-10-13
Thrust pad assembly for ECP system App 20050121329 - Tsao, Jung-Chih ; et al.	2005-06-09
Method of reducing the pattern effect in the CMP process App 20050118808 - Liu, Chi-Wen ; et al.	2005-06-02
Electrostatic chuck assembly having disassembling device App 20050094349 - Chang, Cheng-Liang ; et al.	2005-05-05
Novel method to reduce Rs pattern dependence effect App 20050085066 - Tsao, Jung-Chih ; et al.	2005-04-21

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