Patent | Date |
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Surface modification of a porous organic material through the use of a supercritical fluid Grant 7,354,623 - Wang , et al. April 8, 2 | 2008-04-08 |
Method for manufacturing optical element App 20070171529 - Chuang; Ping | 2007-07-26 |
Optical module App 20070153391 - Chuang; Ping | 2007-07-05 |
Method for adjusting light diffusing and light focusing capability of an optical element App 20070153669 - Chuang; Ping | 2007-07-05 |
Prism manufacturing method App 20060249863 - Chuang; Ping | 2006-11-09 |
Planarizing method employing hydrogenated silicon nitride planarizing stop layer Grant 7,129,151 - Chuang , et al. October 31, 2 | 2006-10-31 |
Flexible Land Grid Array Connector App 20060084288 - Chuang; Ping ;   et al. | 2006-04-20 |
Flexible land grid array connector Grant 7,021,941 - Chuang , et al. April 4, 2 | 2006-04-04 |
Method and composition to improve a nitride/oxide wet etching selectivity Grant 6,987,064 - Chuang , et al. January 17, 2 | 2006-01-17 |
Method for metallizing a rubber surface and structure App 20060003169 - Chuang; Ping ;   et al. | 2006-01-05 |
Surface modification of a porous organic material through the use of a supercritical fluid App 20050260402 - Wang, Ching-Ya ;   et al. | 2005-11-24 |
Multi-function slurry delivery system App 20050202763 - Chen, Ping-Hsu ;   et al. | 2005-09-15 |
FIB exposure of alignment marks in MIM technology App 20050186753 - Chen, Ping-Hsu ;   et al. | 2005-08-25 |
Method of integrating post-etching cleaning process with deposition for semiconductor device App 20050158664 - Tseng, Joshua ;   et al. | 2005-07-21 |
Method of forming an oxide layer using a mixture of a supercritical state fluid and an oxidizing agent App 20050130449 - Chuang, Ping ;   et al. | 2005-06-16 |
Supercritical water application for oxide formation App 20050106895 - Lin, Yu-Liang ;   et al. | 2005-05-19 |
Planarizing method employing hydrogenated silicon nitride planarizing stop layer App 20050095864 - Chuang, Ping ;   et al. | 2005-05-05 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry Grant 6,884,149 - Tsai , et al. April 26, 2 | 2005-04-26 |
System and method for dampening high pressure impact on porous materials Grant 6,875,285 - Wang , et al. April 5, 2 | 2005-04-05 |
Polishing pad conditioning disks for chemical mechanical polisher Grant 6,872,127 - Lin , et al. March 29, 2 | 2005-03-29 |
System and method for dampening high pressure impact on porous materials App 20040211440 - Wang, Ching-Ya ;   et al. | 2004-10-28 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry App 20040203322 - Tsai, Shang-Ting ;   et al. | 2004-10-14 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry Grant 6,729,935 - Tsai , et al. May 4, 2 | 2004-05-04 |
Method and composition to improve a nitride/oxide wet etching selectivity App 20040077171 - Chuang, Ping ;   et al. | 2004-04-22 |
Polishing pad conditioning disks for chemical mechanical polisher App 20040009742 - Lin, Yu-Liang ;   et al. | 2004-01-15 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry App 20030232575 - Tsai, Shang-Ting ;   et al. | 2003-12-18 |
Method for avoiding slurry sedimentation in CMP slurry delivery systems App 20030211743 - Chang, Chao-Jung ;   et al. | 2003-11-13 |