CHUANG; NAN-CHIN
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHUANG; NAN-CHIN.The latest application filed is for "circuit board and electronic apparatus using the same".
- CHUANG; NAN-CHIN - HSINCHU TW
- Chuang; Nan-Chin - Taipei TW
- Chuang; Nan-Chin - Taipei City TW
| Patent | Date |
|---|---|
| Circuit Board And Electronic Apparatus Using The Same App 20220312579 - LO; CHIN-YUAN ; et al. | 2022-09-29 |
| Package Substrate And Chip Package Structure Using The Same App 20220278033 - HSIEH; HAN-CHIEH ; et al. | 2022-09-01 |
| Package structure and manufacturing method thereof Grant 11,335,655 - Wan , et al. May 17, 2 | 2022-05-17 |
| Semiconductor package Grant 11,227,854 - Lo , et al. January 18, 2 | 2022-01-18 |
| Integrated fan-out package with antenna components and manufacturing method thereof Grant 11,145,595 - Lu , et al. October 12, 2 | 2021-10-12 |
| Package Structure App 20210313671 - Chuang; Nan-Chin ; et al. | 2021-10-07 |
| Package structure Grant 11,043,731 - Chuang , et al. June 22, 2 | 2021-06-22 |
| Semiconductor package structure Grant 11,004,810 - Wu , et al. May 11, 2 | 2021-05-11 |
| Memory device including noise-suppressing mechanism Grant 10,998,016 - Lo , et al. May 4, 2 | 2021-05-04 |
| Semiconductor Package App 20210118846 - Lo; Chin-Yuan ; et al. | 2021-04-22 |
| Package Structure And Manufacturing Method Thereof App 20210098396 - Wan; Albert ; et al. | 2021-04-01 |
| Package structure and manufacturing method thereof Grant 10,867,940 - Wan , et al. December 15, 2 | 2020-12-15 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20200152570 - Lu; Chun-Lin ; et al. | 2020-05-14 |
| Semiconductor Package Structure App 20200118952 - Wu; Kai-Chiang ; et al. | 2020-04-16 |
| Integrated fan-out package having multi-band antenna and method of forming the same Grant 10,622,222 - Chuang , et al. | 2020-04-14 |
| Memory Device App 20200075066 - Lo; Chin-Yuan ; et al. | 2020-03-05 |
| Package Structure App 20200067173 - Chuang; Nan-Chin ; et al. | 2020-02-27 |
| Package Structure And Manufacturing Method Thereof App 20200058607 - Wan; Albert ; et al. | 2020-02-20 |
| Integrated fan-out package and manufacturing method thereof Grant 10,553,533 - Lu , et al. Fe | 2020-02-04 |
| Semiconductor package structure Grant 10,510,693 - Wu , et al. Dec | 2019-12-17 |
| Package structure Grant 10,483,617 - Chuang , et al. Nov | 2019-11-19 |
| Package structure and manufacturing method thereof Grant 10,475,757 - Wan , et al. Nov | 2019-11-12 |
| Integrated Fan-out Package Having Multi-band Antenna And Method Of Forming The Same App 20190287819 - Chuang; Nan-Chin ; et al. | 2019-09-19 |
| Integrated fan-out package having multi-band antenna and method of forming the same Grant 10,312,112 - Chuang , et al. | 2019-06-04 |
| Package Structure And Manufacturing Method Thereof App 20190157224 - Wan; Albert ; et al. | 2019-05-23 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20190139890 - Lu; Chun-Lin ; et al. | 2019-05-09 |
| Package Structure App 20190103652 - Chuang; Nan-Chin ; et al. | 2019-04-04 |
| Semiconductor Package Structure App 20190096828 - Wu; Kai-Chiang ; et al. | 2019-03-28 |
| Package Structure And Manufacturing Method Thereof App 20190027449 - Wan; Albert ; et al. | 2019-01-24 |
| Package structure and manufacturing method thereof Grant 10,186,492 - Wan , et al. Ja | 2019-01-22 |
| Integrated Fan-out Package Having Multi-band Antenna And Method Of Forming The Same App 20180366347 - Chuang; Nan-Chin ; et al. | 2018-12-20 |
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