Patent | Date |
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Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20120094407 - WANG; BILY ;   et al. | 2012-04-19 |
Package for a light emitting diode and method for fabricating the same Grant 8,137,999 - Wang , et al. March 20, 2 | 2012-03-20 |
Method Of Manufacturing A Led Chip Package Structure App 20120009700 - WANG; BILY ;   et al. | 2012-01-12 |
Led Chip Package Structure App 20120001203 - WANG; BILY ;   et al. | 2012-01-05 |
Package For A Light Emitting Diode And Method For Fabricating The Same App 20110300649 - WANG; BILY ;   et al. | 2011-12-08 |
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same Grant 8,003,413 - Wang , et al. August 23, 2 | 2011-08-23 |
Light-guiding Structure With Phosphor Material Layers App 20110170317 - WANG; BILY ;   et al. | 2011-07-14 |
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same Grant 7,951,621 - Wang , et al. May 31, 2 | 2011-05-31 |
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same Grant 7,923,745 - Wang , et al. April 12, 2 | 2011-04-12 |
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20100301349 - WANG; BILY ;   et al. | 2010-12-02 |
Front and rear covering type LED package structure and method for packaging the same Grant 7,842,964 - Wang , et al. November 30, 2 | 2010-11-30 |
LED chip package structure with high-efficiency light-emitting effect and method of packing the same Grant 7,834,365 - Wang , et al. November 16, 2 | 2010-11-16 |
LED lamp structure and system with high-efficiency heat-dissipating function Grant 7,828,464 - Wang , et al. November 9, 2 | 2010-11-09 |
Method for manufacturing an LED chip package structure Grant 7,824,938 - Wang , et al. November 2, 2 | 2010-11-02 |
Light-guiding Structure With Phosphor Material Layers App 20100271844 - Wang; Bily ;   et al. | 2010-10-28 |
Multi-wavelength white light-emitting structure Grant 7,804,162 - Wang , et al. September 28, 2 | 2010-09-28 |
Mold structure for packaging LED chips and method thereof Grant 7,803,641 - Wang , et al. September 28, 2 | 2010-09-28 |
Method for manufacturing a light-emitting diode having high heat-dissipating efficiency Grant 7,749,781 - Wang , et al. July 6, 2 | 2010-07-06 |
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same Grant 7,741,648 - Wang , et al. June 22, 2 | 2010-06-22 |
High efficiency white light emitting diode and method for manufacturing the same Grant 7,737,635 - Wang , et al. June 15, 2 | 2010-06-15 |
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same App 20100099207 - Wang; Bily ;   et al. | 2010-04-22 |
White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend Grant 7,701,124 - Wang , et al. April 20, 2 | 2010-04-20 |
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same Grant 7,671,373 - Wang , et al. March 2, 2 | 2010-03-02 |
LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same Grant 7,671,374 - Wang , et al. March 2, 2 | 2010-03-02 |
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof Grant 7,662,661 - Wang , et al. February 16, 2 | 2010-02-16 |
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same Grant 7,655,997 - Wang , et al. February 2, 2 | 2010-02-02 |
LED chip package structure and method for manufacturing the same App 20090246897 - Wang; Bily ;   et al. | 2009-10-01 |
Package for a light emitting diode and a process for fabricating the same App 20090239319 - Wang; Bily ;   et al. | 2009-09-24 |
Led chip package structre with a plurality of thick guiding and a method for manufactruing the same App 20090186434 - Wang; Bily ;   et al. | 2009-07-23 |
Laminated light-emitting diode display device and manufacturing method thereof Grant 7,563,641 - Wang , et al. July 21, 2 | 2009-07-21 |
Multi-wavelength white light-emitting structure App 20090152574 - Wang; Bily ;   et al. | 2009-06-18 |
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same App 20090124032 - Wang; Bily ;   et al. | 2009-05-14 |
LED package structure for increasing light-emitting efficiency and method of packaging the same Grant 7,515,061 - Wang , et al. April 7, 2 | 2009-04-07 |
LED chip package structure with high-efficiency light-emitting effect and method of packing the same App 20090065789 - Wang; Bily ;   et al. | 2009-03-12 |
Front and rear covering type LED package structure and method for packaging the same App 20090050922 - Wang; Bily ;   et al. | 2009-02-26 |
Method of manufacturing high power light-emitting device package and structure thereof Grant 7,485,480 - Wang , et al. February 3, 2 | 2009-02-03 |
Led Chip Package Structure With High-efficiency Light-emitting Effect And Method Of Packaging The Same App 20090020770 - Wang; Bily ;   et al. | 2009-01-22 |
Method of manufacturing high power light-emitting device package and structure thereof App 20090014745 - Wang; Bily ;   et al. | 2009-01-15 |
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same App 20090008656 - Wang; Bily ;   et al. | 2009-01-08 |
LED lamp structure and system with high-efficiency heat-dissipating function App 20090009999 - Wang; Bily ;   et al. | 2009-01-08 |
Manufacturing Method Of White Light Led And Structure Thereof App 20080246397 - Wang; Bily ;   et al. | 2008-10-09 |
Composition Of Led Frame Body And Manufacturing Method Thereof App 20080246185 - Wang; Bily ;   et al. | 2008-10-09 |
Method For Manufacturing A Light-emitting Diode Having High Heat-dissipating Efficiency App 20080194048 - WANG; Bily ;   et al. | 2008-08-14 |
Light Emitting Diode Structure With High Heat Dissipation App 20080191235 - WANG; Bily ;   et al. | 2008-08-14 |
Led Chip Package Structure With A Plurality Of Thick Guiding Pins And A Method For Manufacturing The Same App 20080179604 - Wang; Bily ;   et al. | 2008-07-31 |
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same App 20080173881 - Wang; Bily ;   et al. | 2008-07-24 |
Mold Structure For Packaging Led Chips And Method Thereof App 20080160658 - WANG; BILY ;   et al. | 2008-07-03 |
LED package structure for increasing light-emitting effiency and method of packaging the same App 20080099778 - Wang; Bily ;   et al. | 2008-05-01 |
Method of manufacturing high power light-emitting device package and structure thereof App 20080073662 - Wang; Bily ;   et al. | 2008-03-27 |
LED chip package structure and method for manufacturing the same App 20080012035 - Wang; Bily ;   et al. | 2008-01-17 |
Modular lamp structure App 20070297177 - Wang; Bily ;   et al. | 2007-12-27 |
Package for a light emitting diode and a process for fabricating the same App 20070290220 - Wang; Bily ;   et al. | 2007-12-20 |
Semiconductor substrate structure and processing method thereof Grant 7,303,984 - Wang , et al. December 4, 2 | 2007-12-04 |
Package structure for semiconductor Grant 7,276,782 - Wang , et al. October 2, 2 | 2007-10-02 |
Lighting module Grant 7,255,463 - Wang , et al. August 14, 2 | 2007-08-14 |
White light-emitting device App 20070152562 - Wang; Bily ;   et al. | 2007-07-05 |
Backlight module Grant 7,237,938 - Wang , et al. July 3, 2 | 2007-07-03 |
Electrical lamp apparatus App 20070133209 - Wang; Bily ;   et al. | 2007-06-14 |
White light emitting diode light source and method for manufacturing the same App 20070132359 - Wang; Bily ;   et al. | 2007-06-14 |
LED package structure and method for making the same Grant 7,211,882 - Wang , et al. May 1, 2 | 2007-05-01 |
Laminated light-emitting diode display device and manufacturing method thereof App 20070072506 - Wang; Bily ;   et al. | 2007-03-29 |
Circuit board for large screen LED matrix array display Grant 7,142,181 - Wang , et al. November 28, 2 | 2006-11-28 |
Water-cooling heat dissipation device adopted for modulized LEDs Grant 7,140,753 - Wang , et al. November 28, 2 | 2006-11-28 |
Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same App 20060261488 - Wang; Bily ;   et al. | 2006-11-23 |
LED package structure and method making of the same App 20060261455 - Wang; Bily ;   et al. | 2006-11-23 |
Wafer-level electro-optical semiconductor manufacture fabrication method App 20060258031 - Wang; Bily ;   et al. | 2006-11-16 |
Multi-wavelength white light emitting diode App 20060249739 - Wang; Bily ;   et al. | 2006-11-09 |
Lighting module App 20060232983 - Wang; Bily ;   et al. | 2006-10-19 |
Backlight module App 20060215387 - Wang; Bily ;   et al. | 2006-09-28 |
LED package structure and method making of the same App 20060214273 - Wang; Bily ;   et al. | 2006-09-28 |
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same App 20060166477 - Wang; Bily ;   et al. | 2006-07-27 |
LED packaging structure Grant 7,049,639 - Wang , et al. May 23, 2 | 2006-05-23 |
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof App 20060099728 - Wang; Bily ;   et al. | 2006-05-11 |
Package structure for optical-electrical semiconductor App 20060086945 - Wang; Bily ;   et al. | 2006-04-27 |
LED lamp App 20060082994 - Wang; Bily ;   et al. | 2006-04-20 |
Semiconductor substrate structure App 20060071328 - Wang; Bily ;   et al. | 2006-04-06 |
Mixing light board App 20060044796 - Wang; Bily ;   et al. | 2006-03-02 |
Laminated light-emitting diode display device and manufacturing method thereof App 20060038485 - Wang; Bily ;   et al. | 2006-02-23 |
Water-cooling heat dissipation device adopted for modulized LEDs App 20060034085 - Wang; Bily ;   et al. | 2006-02-16 |
Light-emitting diode lamp App 20060034071 - Wang; Bily ;   et al. | 2006-02-16 |
Semiconductor substrate structure and processing method thereof App 20060035407 - Wang; Bily ;   et al. | 2006-02-16 |
Method Of Forming A Composite Polymer Material Inside Trenches Of A Semiconductor Substrate To Form A Composite Polymer Structure App 20060035406 - Wang; Bily ;   et al. | 2006-02-16 |
LED packaging structure App 20050274957 - Wang, Bily ;   et al. | 2005-12-15 |
White light emitting diode light source and method for manufacturing the same App 20050264173 - Wang, Bily ;   et al. | 2005-12-01 |
Light-emitting diode Grant D511,328 - Wang , et al. November 8, 2 | 2005-11-08 |
White light-emitting device App 20050236958 - Wang, Bily ;   et al. | 2005-10-27 |
Flexible light array and fabrication procedure thereof App 20050207156 - Wang, Bily ;   et al. | 2005-09-22 |
Metal base design for surface mount device LED Grant D509,809 - Wang , et al. September 20, 2 | 2005-09-20 |
Light emitting diode package Grant D509,195 - Wang , et al. September 6, 2 | 2005-09-06 |
Led chip lamp apparatus App 20050169006 - Wang, Bily ;   et al. | 2005-08-04 |
White light source Grant 6,919,584 - Wang , et al. July 19, 2 | 2005-07-19 |
Light emitting diode package Grant D507,544 - Wang , et al. July 19, 2 | 2005-07-19 |
Light emitting diode package Grant D507,246 - Wang , et al. July 12, 2 | 2005-07-12 |
Package structure for semiconductor App 20050139855 - Wang, Bily ;   et al. | 2005-06-30 |
Light-emitting diode Grant D506,732 - Wang , et al. June 28, 2 | 2005-06-28 |
Optical projection device of a colored lighting module App 20050135113 - Wang, Bily ;   et al. | 2005-06-23 |
Light source structure of light emitting diode App 20050128767 - Wang, Bily ;   et al. | 2005-06-16 |
Metal base design for surface mount device LED (light emitting diode) Grant D506,187 - Wang , et al. June 14, 2 | 2005-06-14 |
Ic Package With Stacked Sheet Metal Substrate App 20050093010 - Wang, Bily ;   et al. | 2005-05-05 |
IC package with stacked sheet metal substrate Grant 6,885,037 - Wang , et al. April 26, 2 | 2005-04-26 |
Circuit board for large screen LED matrix array display App 20050083275 - Wang, Bily ;   et al. | 2005-04-21 |
White light source from light emitting diode Grant 6,841,934 - Wang , et al. January 11, 2 | 2005-01-11 |
White light source App 20040256626 - Wang, Bily ;   et al. | 2004-12-23 |
Random partitionable dot matrix LED display Grant 6,784,458 - Wang , et al. August 31, 2 | 2004-08-31 |
White light source from light emitting diode App 20040164675 - Wang, Bily ;   et al. | 2004-08-26 |