CHUANG; JONNIE

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHUANG; JONNIE.The latest application filed is for "wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the same".

Company Profile

0.40.65

CHUANG; JONNIE - TAIPEI HSIEN TW
CHUANG; JONNIE - NEW TAIPEI CITY TW
Chuang; Jonnie - Banciao TW
CHUANG; JONNIE - Taipei County TW
Chuang; Jonnie - Banciao City TW
Chuang; Jonnie - Pan Chiao TW
Chuang; Jonnie - Hsin Chu TW
Chuang; Jonnie - Pan Chiao City TW
Chuang; Jonnie - Taipei TW
Chuang; Jonnie - Chiao City TW
Chuang; Jonnie - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20120094407 - WANG; BILY ; et al.	2012-04-19
Package for a light emitting diode and method for fabricating the same Grant 8,137,999 - Wang , et al. March 20, 2	2012-03-20
Method Of Manufacturing A Led Chip Package Structure App 20120009700 - WANG; BILY ; et al.	2012-01-12
Led Chip Package Structure App 20120001203 - WANG; BILY ; et al.	2012-01-05
Package For A Light Emitting Diode And Method For Fabricating The Same App 20110300649 - WANG; BILY ; et al.	2011-12-08
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same Grant 8,003,413 - Wang , et al. August 23, 2	2011-08-23
Light-guiding Structure With Phosphor Material Layers App 20110170317 - WANG; BILY ; et al.	2011-07-14
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same Grant 7,951,621 - Wang , et al. May 31, 2	2011-05-31
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same Grant 7,923,745 - Wang , et al. April 12, 2	2011-04-12
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20100301349 - WANG; BILY ; et al.	2010-12-02
Front and rear covering type LED package structure and method for packaging the same Grant 7,842,964 - Wang , et al. November 30, 2	2010-11-30
LED chip package structure with high-efficiency light-emitting effect and method of packing the same Grant 7,834,365 - Wang , et al. November 16, 2	2010-11-16
LED lamp structure and system with high-efficiency heat-dissipating function Grant 7,828,464 - Wang , et al. November 9, 2	2010-11-09
Method for manufacturing an LED chip package structure Grant 7,824,938 - Wang , et al. November 2, 2	2010-11-02
Light-guiding Structure With Phosphor Material Layers App 20100271844 - Wang; Bily ; et al.	2010-10-28
Multi-wavelength white light-emitting structure Grant 7,804,162 - Wang , et al. September 28, 2	2010-09-28
Mold structure for packaging LED chips and method thereof Grant 7,803,641 - Wang , et al. September 28, 2	2010-09-28
Method for manufacturing a light-emitting diode having high heat-dissipating efficiency Grant 7,749,781 - Wang , et al. July 6, 2	2010-07-06
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same Grant 7,741,648 - Wang , et al. June 22, 2	2010-06-22
High efficiency white light emitting diode and method for manufacturing the same Grant 7,737,635 - Wang , et al. June 15, 2	2010-06-15
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same App 20100099207 - Wang; Bily ; et al.	2010-04-22
White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend Grant 7,701,124 - Wang , et al. April 20, 2	2010-04-20
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same Grant 7,671,373 - Wang , et al. March 2, 2	2010-03-02
LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same Grant 7,671,374 - Wang , et al. March 2, 2	2010-03-02
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof Grant 7,662,661 - Wang , et al. February 16, 2	2010-02-16
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same Grant 7,655,997 - Wang , et al. February 2, 2	2010-02-02
LED chip package structure and method for manufacturing the same App 20090246897 - Wang; Bily ; et al.	2009-10-01
Package for a light emitting diode and a process for fabricating the same App 20090239319 - Wang; Bily ; et al.	2009-09-24
Led chip package structre with a plurality of thick guiding and a method for manufactruing the same App 20090186434 - Wang; Bily ; et al.	2009-07-23
Laminated light-emitting diode display device and manufacturing method thereof Grant 7,563,641 - Wang , et al. July 21, 2	2009-07-21
Multi-wavelength white light-emitting structure App 20090152574 - Wang; Bily ; et al.	2009-06-18
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same App 20090124032 - Wang; Bily ; et al.	2009-05-14
LED package structure for increasing light-emitting efficiency and method of packaging the same Grant 7,515,061 - Wang , et al. April 7, 2	2009-04-07
LED chip package structure with high-efficiency light-emitting effect and method of packing the same App 20090065789 - Wang; Bily ; et al.	2009-03-12
Front and rear covering type LED package structure and method for packaging the same App 20090050922 - Wang; Bily ; et al.	2009-02-26
Method of manufacturing high power light-emitting device package and structure thereof Grant 7,485,480 - Wang , et al. February 3, 2	2009-02-03
Led Chip Package Structure With High-efficiency Light-emitting Effect And Method Of Packaging The Same App 20090020770 - Wang; Bily ; et al.	2009-01-22
Method of manufacturing high power light-emitting device package and structure thereof App 20090014745 - Wang; Bily ; et al.	2009-01-15
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same App 20090008656 - Wang; Bily ; et al.	2009-01-08
LED lamp structure and system with high-efficiency heat-dissipating function App 20090009999 - Wang; Bily ; et al.	2009-01-08
Manufacturing Method Of White Light Led And Structure Thereof App 20080246397 - Wang; Bily ; et al.	2008-10-09
Composition Of Led Frame Body And Manufacturing Method Thereof App 20080246185 - Wang; Bily ; et al.	2008-10-09
Method For Manufacturing A Light-emitting Diode Having High Heat-dissipating Efficiency App 20080194048 - WANG; Bily ; et al.	2008-08-14
Light Emitting Diode Structure With High Heat Dissipation App 20080191235 - WANG; Bily ; et al.	2008-08-14
Led Chip Package Structure With A Plurality Of Thick Guiding Pins And A Method For Manufacturing The Same App 20080179604 - Wang; Bily ; et al.	2008-07-31
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same App 20080173881 - Wang; Bily ; et al.	2008-07-24
Mold Structure For Packaging Led Chips And Method Thereof App 20080160658 - WANG; BILY ; et al.	2008-07-03
LED package structure for increasing light-emitting effiency and method of packaging the same App 20080099778 - Wang; Bily ; et al.	2008-05-01
Method of manufacturing high power light-emitting device package and structure thereof App 20080073662 - Wang; Bily ; et al.	2008-03-27
LED chip package structure and method for manufacturing the same App 20080012035 - Wang; Bily ; et al.	2008-01-17
Modular lamp structure App 20070297177 - Wang; Bily ; et al.	2007-12-27
Package for a light emitting diode and a process for fabricating the same App 20070290220 - Wang; Bily ; et al.	2007-12-20
Semiconductor substrate structure and processing method thereof Grant 7,303,984 - Wang , et al. December 4, 2	2007-12-04
Package structure for semiconductor Grant 7,276,782 - Wang , et al. October 2, 2	2007-10-02
Lighting module Grant 7,255,463 - Wang , et al. August 14, 2	2007-08-14
White light-emitting device App 20070152562 - Wang; Bily ; et al.	2007-07-05
Backlight module Grant 7,237,938 - Wang , et al. July 3, 2	2007-07-03
Electrical lamp apparatus App 20070133209 - Wang; Bily ; et al.	2007-06-14
White light emitting diode light source and method for manufacturing the same App 20070132359 - Wang; Bily ; et al.	2007-06-14
LED package structure and method for making the same Grant 7,211,882 - Wang , et al. May 1, 2	2007-05-01
Laminated light-emitting diode display device and manufacturing method thereof App 20070072506 - Wang; Bily ; et al.	2007-03-29
Circuit board for large screen LED matrix array display Grant 7,142,181 - Wang , et al. November 28, 2	2006-11-28
Water-cooling heat dissipation device adopted for modulized LEDs Grant 7,140,753 - Wang , et al. November 28, 2	2006-11-28
Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same App 20060261488 - Wang; Bily ; et al.	2006-11-23
LED package structure and method making of the same App 20060261455 - Wang; Bily ; et al.	2006-11-23
Wafer-level electro-optical semiconductor manufacture fabrication method App 20060258031 - Wang; Bily ; et al.	2006-11-16
Multi-wavelength white light emitting diode App 20060249739 - Wang; Bily ; et al.	2006-11-09
Lighting module App 20060232983 - Wang; Bily ; et al.	2006-10-19
Backlight module App 20060215387 - Wang; Bily ; et al.	2006-09-28
LED package structure and method making of the same App 20060214273 - Wang; Bily ; et al.	2006-09-28
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same App 20060166477 - Wang; Bily ; et al.	2006-07-27
LED packaging structure Grant 7,049,639 - Wang , et al. May 23, 2	2006-05-23
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof App 20060099728 - Wang; Bily ; et al.	2006-05-11
Package structure for optical-electrical semiconductor App 20060086945 - Wang; Bily ; et al.	2006-04-27
LED lamp App 20060082994 - Wang; Bily ; et al.	2006-04-20
Semiconductor substrate structure App 20060071328 - Wang; Bily ; et al.	2006-04-06
Mixing light board App 20060044796 - Wang; Bily ; et al.	2006-03-02
Laminated light-emitting diode display device and manufacturing method thereof App 20060038485 - Wang; Bily ; et al.	2006-02-23
Water-cooling heat dissipation device adopted for modulized LEDs App 20060034085 - Wang; Bily ; et al.	2006-02-16
Light-emitting diode lamp App 20060034071 - Wang; Bily ; et al.	2006-02-16
Semiconductor substrate structure and processing method thereof App 20060035407 - Wang; Bily ; et al.	2006-02-16
Method Of Forming A Composite Polymer Material Inside Trenches Of A Semiconductor Substrate To Form A Composite Polymer Structure App 20060035406 - Wang; Bily ; et al.	2006-02-16
LED packaging structure App 20050274957 - Wang, Bily ; et al.	2005-12-15
White light emitting diode light source and method for manufacturing the same App 20050264173 - Wang, Bily ; et al.	2005-12-01
Light-emitting diode Grant D511,328 - Wang , et al. November 8, 2	2005-11-08
White light-emitting device App 20050236958 - Wang, Bily ; et al.	2005-10-27
Flexible light array and fabrication procedure thereof App 20050207156 - Wang, Bily ; et al.	2005-09-22
Metal base design for surface mount device LED Grant D509,809 - Wang , et al. September 20, 2	2005-09-20
Light emitting diode package Grant D509,195 - Wang , et al. September 6, 2	2005-09-06
Led chip lamp apparatus App 20050169006 - Wang, Bily ; et al.	2005-08-04
White light source Grant 6,919,584 - Wang , et al. July 19, 2	2005-07-19
Light emitting diode package Grant D507,544 - Wang , et al. July 19, 2	2005-07-19
Light emitting diode package Grant D507,246 - Wang , et al. July 12, 2	2005-07-12
Package structure for semiconductor App 20050139855 - Wang, Bily ; et al.	2005-06-30
Light-emitting diode Grant D506,732 - Wang , et al. June 28, 2	2005-06-28
Optical projection device of a colored lighting module App 20050135113 - Wang, Bily ; et al.	2005-06-23
Light source structure of light emitting diode App 20050128767 - Wang, Bily ; et al.	2005-06-16
Metal base design for surface mount device LED (light emitting diode) Grant D506,187 - Wang , et al. June 14, 2	2005-06-14
Ic Package With Stacked Sheet Metal Substrate App 20050093010 - Wang, Bily ; et al.	2005-05-05
IC package with stacked sheet metal substrate Grant 6,885,037 - Wang , et al. April 26, 2	2005-04-26
Circuit board for large screen LED matrix array display App 20050083275 - Wang, Bily ; et al.	2005-04-21
White light source from light emitting diode Grant 6,841,934 - Wang , et al. January 11, 2	2005-01-11
White light source App 20040256626 - Wang, Bily ; et al.	2004-12-23
Random partitionable dot matrix LED display Grant 6,784,458 - Wang , et al. August 31, 2	2004-08-31
White light source from light emitting diode App 20040164675 - Wang, Bily ; et al.	2004-08-26

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