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Patent applications and USPTO patent grants for CHUANG; Jimmy.The latest application filed is for "readily assembled/disassembled cooling assembly for immersion cooled semiconductor chip package".
Patent | Date |
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Readily Assembled/disassembled Cooling Assembly For Immersion Cooled Semiconductor Chip Package App 20220223495 - SHIA; David ;   et al. | 2022-07-14 |
Thermally Conductive Chamber With Stiffening Structure For Thermal Cooling Assembly Of Semiconductor Chip Package Under High Loading Force App 20210410329 - YANG; Jin ;   et al. | 2021-12-30 |
Boiling Enhancement Structures For Immersion Cooled Electronic Systems App 20210327787 - YANG; Jin ;   et al. | 2021-10-21 |
Liquid Cooled Module For Narrow Pitch Slots App 20210321543 - TAN; Guixiang ;   et al. | 2021-10-14 |
Technologies For Liquid Cooling Interfaces App 20210216121 - Weldon; Kristin L. ;   et al. | 2021-07-15 |
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